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Journal of Thermal Spray Technology
Publishing model:
Hybrid
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Journal of Thermal Spray Technology - Call for Papers: Special Issue on Intelligent Coating Processes

This special issue aims to showcase the latest advancements of the research and applications on these topics, highlighting cutting-edge solutions being implemented in digital integration and what could be summarized, in one expression, the development of “intelligent coating processes.” Topics of interest include (but are not limited to):

  • Use of artificial intelligence (AI)/machine learning (ML) to design materials and microstructures of coatings by thermal spraying and related technologies like laser cladding/laser-DED
  • Use of artificial intelligence (AI)/machine learning (ML) for automated intelligent decision support to select and control process conditions and outcomes
  • Integrated multiscale modelling of coatings and deposition processes for digital twin creation
  • Data-driven process development
  • Development of intelligent and integrated monitoring and control systems

All contributions will be rigorously peer-reviewed. Further information, including JTST submission procedures and advice on preparing your manuscript, can be found under the heading “For Authors and Editors” using the following link: http://www.springer.com/materials/surfaces+interfaces/journal/11666. Please indicate in your cover letter that you are submitting a contribution to the special issue on “Intelligent Coating Processes.”

Important Dates:

  • Abstract submission by May 30, 2025
  • Manuscript submission by July 31, 2025

Guest Editors:

  • Dr. Alejandro Vargas-Uscategui, CSIRO Manufacturing, Australia
  • Professor Ali Dolatabadi, University of Toronto, Canada
  • Dr. Anssi Laukkanen, VTT Technical Research Center of Finland, Finland

Potential authors are highly encouraged to submit an abstract to Dr. Vargas-Uscategui (alejandro.vargas@csiro.au), Prof. Dolatabadi (ali.dolatabadi@utoronto.ca), or Dr. Laukkanen (anssi.laukkanen@vtt.fi) for consideration and comment prior to preparation of a full manuscript.

Additional information can be found here.

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