Editors

EDITOR-IN-CHIEF

F. Shadi Shahedipour-Sandvik, SUNY Polytechnic Institute

SENIOR EDITOR

John D. Baniecki, Fujitsu Laboratories, Japan

SECTION EDITORS

Wojciech Jadwisienczak, Ohio University
Tae-Kyu Lee, Portland State University
Manh-Huong Phan, University of South Florida
Dan Ricinschi, Tokyo Institute of Technology, Japan

EDITORIAL OVERSIGHT COMMITTEE

C-P. Chang
Applied Materials, Inc.

Q. Jia
State University of New York at Buffalo

S. Mohney
The Pennsylvania State University

S. Nikzad
NASA Jet Propulsion Laboratory

B. Wessels
Northwestern University

ASSOCIATE EDITORS

III-V and II-VI Semiconductor Materials
John E. Ayers, University of Connecticut, Storrs, CT

III-V As and Sb Based Materials and Devices
Ganesh Balakrishnan, University of New Mexico, Albuquerque, NM

Crystal Growth
Ishwara Bhat, Rensselaer Polytechnic Inst., Troy, NY

II-VI Materials and Electronic Devices, Crystallography and Defects
Gregory Brill, Army Research Laboratory, Adelphi, MD

Interfaces and Contacts
L.J. Brillson, The Ohio State University, Columbus, OH

Micromechanics
Arief S. Budiman, Singapore University of Technology, and Design, Singapore, Singapore

SiC, Plasmonics, Metamaterials, Phonon, Polaritons, and Emitters
Joshua Caldwell, Vanderbilt University, Nashville, Tennessee

Oxide and Semiconductor Device Modeling and Simulation, Optoelectronic IC, Flexible Electronic and Photonic
Parathasarathi Chakrabarti, Indian Institute of Technology, BHU, Varanasi, India

Packaging and Interconnects
Sinn-wen Chen, National Tsing Hua University, Hsin-chu, Taiwan

Photocatalysis, Thin Film Batteries
Tai Cheuk-Wai, Arrhenius Laboratory, Stockholm University, Stockholm, Sweden

Thermal Management and Composite Materials
Deborah Chung, University at Buffalo, Buffalo, NY

Interconnects and Nanocharacterization
Kathleen Dunn, SUNY Polytechnic Institute, Albany, NY

Materials Integration
Kurt G. Eyink, Air Force Research Laboratory, WPAFB, OH

Processing and Physical Properties of Electronic Ceramics
Tsang-Tse Fang, National Cheng Kung University, Tainan City, Taiwan

Thermoelectric Materials and Devices, Perovskites, Energy Harvesting Systems
Armin Feldhoff, Institute of Physical Chemistry and Electrochemistry, Hannover, Germany

Packaging and Interconnects
Darrel Frear, Freescale Semiconductor, Tempe, AZ

Nanostructures
Zhiyong Gu, University of Massachusetts Lowell, Lowell, MA

Materials Theory and Modeling, Defects and Doping, Complex Functional Materials
Khang Hoang, North Dakota State University, Fargo, ND

Electronic and Ionic Transport in Nonionic Materials
Doo Seok Jeong, Korea Institute of Science and Technology, Seoul, South Korea

Phase Change Memory, Photonic and Optoelectronic
Pei-Cheng Ku, University of Michigan, Ann Arbor, MI

Nano Materials; Opto/Eelectronic and Photonics
Ching-Ting Lee, National Cheng Kung University, Tainan City, Taiwan

Interfaces, Printed Electronics, and Atomistic Simulation
Hyuck Mo Lee, Korea Advanced Institute of Science and Technology, Daejeon, South Korea

Photovoltaics, Nuclear and THZ Detectors, and Chalcogenides
Krishna Mandal, University of South Carolina, Columbia, SC

Solar Energy Materials, Solar Cells, and Photovoltaics
Arturo Morales-Acevedo, CINVESTAV-IPN, México, D. F., México

Sensors, Microstructural Evolution and Packaging
Govindarajan Muralidharan, Oak Ridge National Laboratory, Oak Ridge, TN

Nanostructured and Nanocomposite Materials, Novel Sensors
Paul R. Ohodnicki, National Energy Technology Laboratory, Pittsburgh, PA

Compound Semiconductor and Oxide-based Materials and Devices
Jamie Phillips, University of Michigan, Ann Arbor, MI

Thin Films and Devices
Manuel Quevedo-Lopez, University of Texas at Dallas, Richardson, TX

Microwave Absorbing Composite Materials, Ferromagnetic Microwires
Faxiang Qin, Zhejiang University, Hangzhou, China

Functional Materials, Energy Materials, Magneto-Mechanical and Electro-Mechanical Properties of Materials
Balaram Sahoo, Indian Institute of Science, Bangalore, India

Microwave Properties of Dielectrics and Antennas, Dielectric Resonators
M.T. Sebastian, University of Oulu, Oulu, Finland

Silicon-Based Heterostructures
Michael Tischler, Ocis Technology LLC, Phoenix, AZ

III-V and II-VI Optoelectronic Devices
Jens W. Tomm, Max-Born-Institute, Berlin, Germany

Crystalline and Amorphous Oxide Semiconductors and Devices,Combinatorial Material Science
Holger von Weckstern, Universität Leipzig, Leipzig, Germany

Optoelectronics and Quantum Dots
Jian Xu, The Pennsylvania State University, University Park, PA

Theoretical and Computational Physics and Chemistry, Electronic Materials for Energy Including Electrochemical and Photo-Catalytic Applications
Rui-Qin Zhang, City University of Hong Kong, Kowloon, Hong Kong SAR

Piezoelectrics
Shujun Zhang, The Pennsylvania State University, University Park, PA

2D Materials and Devices, Electrochemical and Photo-Catalytic Applications
Yuebing Zheng, University of Texas, Austin, Austin, TX

Thermoelectric Materials, Zintl Phases, Crystal Growth of Intermetallics
Alexandra Zevelkink, Michigan State University, East Lansing, MI