Call for papers--Special Issue- Nano/Microscale Heat Transfer JTS

Call for papers

Special Issue: Nano/Microscale Heat Transfer
Journal: Journal of Thermal Science

Key dates: 

Full paper submission deadline: July 31, 2021 
Scheduled publication date: October 30, 2021

Guest Editors

Dr. Weigang Ma
Department of Engineering Mechanics, Tsinghua University
Email: maweigang@tsinghua.edu.cn

Dr. Tengfei Luo
Department of Aerospace and Mechanical Engineering, University of Notre Dame
Email: tluo@nd.edu

Dr. Hua Bao
University of Michigan-Shanghai Jiao Tong University Joint Institute, Shanghai Jiao Tong University
Email: hua.bao@sjtu.edu.cn

Dr. Tingting Miao
College of Mechanical and Transportation Engineering, China University of Petroleum-Beijing
Email: mting@cup.edu.cn

Dr. Qinyi Li
Department of Aeronautics and Astronautics, Kyushu University
Email: qinyi.li@aero.kyushu-u.ac.jp


Nano/Microscale heat transfer plays crucial roles in applications like microelectronics, thermoelectrics, thermal energy utilization and thermal management. Studying the fundamental Nano/Microscale heat transfer mechanisms and exploring novel applications are of both academic and technological significance. This special issue will focus on the recent advances in the field of Nano/Microscale heat transfer and its applications. The special issue covers the following topics:

Nano/Microscale Heat conduction, Nano/Microscale phase change, Nano/Microscale convection, and Nano/Microscale radiative heat transfer. Original research papers in both experimental and theoretical aspects are welcome and all manuscripts will be peer-reviewed.

Online submission is now open for this special issue. The submission deadline is July 31, 2021 and the submitted articles will be published online soon after being accepted. The entire special issue will be published by the end of October 2021.