Editors

Editors-in-Chief

Matthias F. Carlsohn
Engineering and Consultancy for
Computer Vision & Image Communication, Bremen, Germany
e-mail: Matthias.Carlsohn@t-online.de

Nasser Kehtarnavaz
University of Texas at Dallas, USA
e-mail: kehtar@utdallas.edu
 

Advisory Board

J. Astola, Tampere University of Technology, Finland
A. Bovik, University of Texas at Austin, USA
T. Ebrahimi, EPFL/STI/IEL/GR-EB, Switzerland
T. Sikora, Technische Universität Berlin, Germany

Editorial Board

A. Aguilar-González, R&D-PolyWorks México, Mexico
M. Akil, Ecole Supérieure d’Ingénieurs en Electronique et Electrotechnique, France
D. Barina, Brno University of Technology, Czech Republic
E. Bellers, Sigma Designs, USA
T. Birdal, Stanford University, USA
M. Biglari-Abhari, University of Auckland, Auckland, New Zealand
G. Botella, Universidad Complutense de Madrid, Spain
A. Bouridane, Northumbria University Newcastle, UK
V. M. Brea, Universidad de Santiago de Compostela, Spain
M. Emre Celebi, University of Central Arkansas, USA
C. Chen, The University of North Carolina at Charlotte, USA
D. B.-W. Chen, Monash University, Australia
D. Chillet, University of Rennes 1 - Inria/Irisa, France
R. Davies, University of London, UK
M. Diani, University of Pisa, Italy
C. P. Fan, National Chung Hsing University, Taichung City, Taiwan, R.O.C.
C. Shann Fuh, National Taiwan University, Taipei, Taiwan
R. Carmona Galán, CSIC-University, Sevilla, Spain
D. Ginhac, Le2i UMR6306 - University of Bourgogne, France
S. Goma, Qualcomm, USA
C. Grecos, Arkansas State University, USA
F. Hannig, Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany
M. Hassaballah, South Valley University, Egypt
F. Hassan, Ohio Northern University, Ada, Ohio, USA
K. M. Hosny, Zagazig University, Egypt
M. Hübner, Ruhr-Universität Bochum, Germany
G. Iannizzotto, University of Messina, Italy
G. Jeon, Incheon National University, Republic of Korea
K. Ben Khalifa, Université de Sousse, Tunisia
B-G. Kim, Sookmyung Women’s University, Republic of Korea
C. Kim, Sejong University, Republic of Korea
T. Krzeszowski, Rzeszow University of Technology, Poland
W. Kurdthongmee, Walailak University, Thasala, Nakornsithammarat, Thailand
G. D. Licciardo, University of Salerno, Italy
L. Lo Bello, University of Catania, Italy
M. Bordallo López, University of Oulu, Finland
S. Marsi, Università di Trieste, Italy
J. Madeiras Pereira, INESC-ID, Portugal
M.P. Malumbres, Miguel Hernandez University, Spain
A. S. Montemayor, Universidad Rey Juan Carlos, Madrid, Spain
H. Meng, Brunel University London, England
A. Nunez, University of Las Palmas Gran Canaria, Spain
A. Omondi, State University of New York (SUNY), Incheon, Republic of Korea
A. El Ouardi, Paris-Saclay University, Paris, France
L. Perroton, ESIEE, France
V. Ponomaryov, Instituto Politécnico Nacional, Mexico
F. Porikli, Australian National University, Australia
C. Qin, University of Shanghai for Science and Technology, China
L. Salgado, Universidad Politecnica de Madrid, Spain
S. Saponara, University of Pisa, Italy
S. Seo, Chung-Ang University, Republic of Korea
M. Shirvaikar, University of Texas at Tyler, USA
B. Smolka, Silesian University of Technology, Poland
L. Sousa, INESC-ID, IST, Universidade de Lisboa, Portugal
S. Stilkerich, Airbus Group Innovations, Germany
C.Y. Tsai, Tamkang University, Tamsui, Taiwan
S. Wang, Qualcomm, USA
L. Zhang, Magna Electronics, Canada
Z. Zhou, Nanjing university of information science and technology, China
Z. Zivkovic, Intel Corporation, The Netherlands