Editors

Editors-in-Chief

Matthias F. Carlsohn
Engineering and Consultancy for
Computer Vision & Image Communication, Bremen, Germany
e-mail: Matthias.Carlsohn@t-online.de

Nasser Kehtarnavaz
University of Texas at Dallas, USA
e-mail: kehtar@utdallas.edu

Advisory Board

J. Astola, Tampere University of Technology, Finland

A. Bovik, University of Texas at Austin, USA

T. Ebrahimi, EPFL/STI/IEL/GR-EB, Switzerland

T. Sikora, Technische Universität Berlin, Germany

Editorial Board

M. Akil, Ecole Supérieure d’Ingénieurs en Electronique et Electrotechnique, France

M. Atiquzzaman, University of Oklahoma, USA

E. Bellers, Sigma Designs, USA

T. Birdal, Technical University of Munich, Germany

G. Botella, Universidad Complutense de Madrid, Spain

A. Bouridane, Northumbria University Newcastle, UK

V. M. Brea, Universidad de Santiago de Compostela, Spain

M. Budagavi, Samsung Research America, USA

M. Emre Celebi, University of Central Arkansas, USA

C. Chen, The University of North Carolina at Charlotte, USA

D. B.-W. Chen, Monash University, Australia

D. Chillet, University of Rennes 1 - Inria/Irisa, France

P. Dang, US Department of Commerce, USA

R. Davies, University of London, UK

M. Diani, University of Pisa, Italy

B. Fishbain, Technion - Israeli Institute of Technology, Israel

R. Carmona Galán, CSIC-University, Sevilla, Spain

D. Ginhac, Le2i UMR6306 - University of Bourgogne, France

S. Goma, Qualcomm, USA

C. Grecos, Central Washington University, USA

F. Hannig, Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany

M. Hübner, Ruhr-Universität Bochum, Germany

G. Iannizzotto, University of Messina, Italy

G. Jeon, Incheon National University, Republic of Korea

K. Ben Khalifa, Université de Sousse, Tunisia

B-G. Kim, Sookmyung Women’s University, Republic of Korea

C. Kim, Sejong University, Republic of Korea

G. D. Licciardo, University of Salerno, Italy

L. Lo Bello, University of Catania, Italy

M. Bordallo López, University of Oulu, Finland

R. Lukac, Epson Canada Ltd, Toronto, Canada

S. Marsi, Università di Trieste, Italy

M. Mehrubeoglu, Texas A&M University-Corpus Christi, USA

A. S. Montemayor, Universidad Rey Juan Carlos, Madrid, Spain

A. Nunez, University of Las Palmas Gran Canaria, Spain

A. Omondi, State University of New York (SUNY), Incheon, Republic of Korea

J. Madeiras Pereira, INESC-ID, Portugal

L. Perroton, ESIEE, France

A. J. Plaza, University of Extremadura, Spain

V. Ponomaryov, Instituto Politécnico Nacional, Mexico

F. Porikli, Australian National University, Australia

C. Qin, University of Shanghai for Science and Technology, China

L. Salgado, Universidad Politecnica de Madrid, Spain

S. Saponara, University of Pisa, Italy

S. Seo, Sungkyul University, Republic of Korea

M. Shirvaikar, University of Texas at Tyler, USA

B. Smolka, Silesian University of Technology, Poland

L. Sousa, INESC-ID, IST, Universidade de Lisboa, Portugal

S. Stilkerich, Airbus Group Innovations, Germany

S. Wang, Qualcomm, USA

L. Zhang, Magna Electronics, Canada

Z. Zivkovic, Intel Corporation, The Netherlands