Editors

Editors-in-Chief

Nathan Ida
The University of Akron, Ohio, USA
ida@uakron.edu

Ming Jiang
Peking University, Beijing, China
ming-jiang@ieee.org

Founding Editor

Cam Nguyen
Dept. of Electrical Engineering, Texas A&M University, College Station, USA

Advisory Board

Gabor T. Herman, The Graduate Center, CUNY, New York, USA

Alfred K. Louis, Saarland University, Saarbruecken, Germany

Eric Todd Quinto, Tufts University, Medford, Massachusetts, USA

Editorial Board

Timothy Bechtel, Franklin and Marshall College, Lancaster, Pennsylvania, USA

Steven Bishop, US Army RDECOM CERDEC, Ft. Belvoir, Virginia, USA

Hartmut Brauer, Technische Universität Ilmenau, Ilmenau, Germany

David Daniels, ERA Technology Ltd., Leatherhead, UK

Panos Datskos, Oak Ridge National Laboratory, Tennessee, USA

Luca Di Rienzo, Politecnico di Milano, Milano, Italy

Bernadette Hahn, Universität Würzburg, Wurzburg, Germany

Tingting Jiang, Peking University, Beijing, China

Tobias Kluth, Universität Bremen, Bremen, Germany

T. Lasri, Institut d'Electronique et de Microélectronique, Villeneuve d'Ascq, France

Y. Le Bihan,Université Paris-Sud - GeePs, Gif-sur-Yvette, France

Shutao Li, Hunan University, Changsha, China

Darren Reynolds, Institute of Bio-Sensing Technology, UWE, UK

Yu Shang, Shanxi Provincial Key Laboratory for Biomedical Imaging and Big Data, North University of China, Taiyuan, China

Michael B. Silevitch, Northeastern University, Boston, Massachusetts, USA

Luminita Vese, University of California, Los Angeles, USA

Benoît Vozel, University of Rennes, France

Sara Wallin, Swedish Research Agency, Sweden

Hongkai Zhao, University of California, Irvine, USA

Hao-Min Zhou, Georgia Institute of Technology, Atlanta