Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.

  • An international forum for fundamental research and new developments in plasma chemistry and plasma processing
  • Offers fundamental plasma studies and studies of specific applications
  • Covers plasma etching in microelectronics, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and more
  • 96% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again
Editor-in-chief
  • Bruce R. Locke,
  • Anthony Murphy
Publishing model
Hybrid. Open Choice – What is this?
Impact
Impact factor: 2.768 (2018)
Five year impact factor: 2.717 (2018)
Speed
Acceptance to publication: 8 days
Usage
Downloads: 84,647 (2018)

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About this journal

Electronic ISSN
1572-8986
Print ISSN
0272-4324
Abstracted and indexed in
  1. Chemical Abstracts Service (CAS)
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