Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.

  • An international forum for fundamental research and new developments in plasma chemistry and plasma processing
  • Offers fundamental plasma studies and studies of specific applications
  • Covers plasma etching in microelectronics, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and more
  • 96% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again

Journal information

Editor-in-Chief
  • Bruce R. Locke,
  • Anthony Murphy
Publishing model
Hybrid (Transformative Journal). Learn about publishing Open Access with us

Journal metrics

2.178 (2019)
Impact factor
2.664 (2019)
Five year impact factor
108,424 (2020)
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Latest articles

This journal has 36 open access articles

Journal updates

  • Call for Paper!

    Special Issue on Scale-up of Plasma Reactors for Bio, Chemical, Environmental, Materials, and Energy Applications

    Journal cover and images of plasma reactors
  • COVID-19 and impact on peer review

    As a result of the significant disruption that is being caused by the COVID-19 pandemic we are very aware that many researchers will have difficulty in meeting the timelines associated with our peer review process during normal times.  Please do let us know if you need additional time. Our systems will continue to remind you of the original timelines but we intend to be highly flexible at this time.

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About this journal

Electronic ISSN
1572-8986
Print ISSN
0272-4324
Abstracted and indexed in
  1. CNKI
  2. Chemical Abstracts Service (CAS)
  3. Current Contents Collections / Electronics & Telecommunications Collection
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