
Plasma Chemistry and Plasma Processing is an international journal that provides a forum for the publication of original papers on fundamental research and new developments in plasma chemistry and plasma processing. The journal encompasses all types of industrial processing plasmas, ranging from nonthermal plasmas to thermal plasmas, and publishes fundamental plasma studies as well as studies of specific plasma applications. Application contexts of interest include plasma etching in microelectronics and other fields, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and others. Includes studies of chemical kinetics in plasmas, and the interactions of plasmas with surfaces.
- An international forum for fundamental research and new developments in plasma chemistry and plasma processing
- Offers fundamental plasma studies and studies of specific applications
- Covers plasma etching in microelectronics, deposition of thin films and coatings, powder synthesis, environmental processing, lighting, surface modification and more
- 96% of authors who answered a survey reported that they would definitely publish or probably publish in the journal again
Journal information
- Editor-in-Chief
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- Bruce R. Locke,
- Anthony Murphy
- Publishing model
- Hybrid (Transformative Journal). Learn about publishing Open Access with us
Journal metrics
- 2.178 (2019)
- Impact factor
- 2.664 (2019)
- Five year impact factor
- 98,639 (2019)
- Downloads
Latest issue
Latest articles
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Oxygen Removal from a Hydrocarbon Containing Gas Stream by Plasma Catalysis
Authors (first, second and last of 4)
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Metabolome Analysis of Selective Inactivation of Human Melanoma and Normal Cells by Cold Atmospheric Plasma
Authors (first, second and last of 10)
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Biological Effects of Cold Atmospheric Pressure Plasma on Skin Cancer
Authors (first, second and last of 6)
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Tubular Membrane-Like Catalysts for the Oxidative Decomposition of Low-Concentrated Toluene in Air by Periodic Short-Term Plasma Discharge
Authors (first, second and last of 4)
Journal updates
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COVID-19 and impact on peer review
As a result of the significant disruption that is being caused by the COVID-19 pandemic we are very aware that many researchers will have difficulty in meeting the timelines associated with our peer review process during normal times. Please do let us know if you need additional time. Our systems will continue to remind you of the original timelines but we intend to be highly flexible at this time.
About this journal
- Electronic ISSN
- 1572-8986
- Print ISSN
- 0272-4324
- Abstracted and indexed in
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- CNKI
- Chemical Abstracts Service (CAS)
- Current Contents Collections / Electronics & Telecommunications Collection
- Current Contents/Engineering, Computing and Technology
- Current Contents/Physical, Chemical and Earth Sciences
- Dimensions
- EBSCO Applied Science & Technology Source
- EBSCO Computers & Applied Sciences Complete
- EBSCO Discovery Service
- EBSCO Engineering Source
- EBSCO STM Source
- EI Compendex
- Google Scholar
- INSPEC
- Institute of Scientific and Technical Information of China
- Japanese Science and Technology Agency (JST)
- Journal Citation Reports/Science Edition
- Naver
- OCLC WorldCat Discovery Service
- ProQuest Central
- ProQuest Materials Science and Engineering Database
- ProQuest SciTech Premium Collection
- ProQuest Technology Collection
- ProQuest-ExLibris Primo
- ProQuest-ExLibris Summon
- SCImago
- SCOPUS
- Science Citation Index
- Science Citation Index Expanded (SciSearch)
- Semantic Scholar
- TD Net Discovery Service
- UGC-CARE List (India)
- WTI Frankfurt eG
- Copyright information
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© Springer Science+Business Media, LLC, part of Springer Nature