Skip to main content
Log in

Editors

Editor-in-Chief:
Borko Furht,
Dept. of Computer Science and Engineering, Florida Atlantic University, Florida, USA

Section Editors:
Harry Agius, Brunel University London, United Kingdom
Zheng DongWayne State University, Detroit, Michigan, USA
Jungong Han, Aberystwyth University, United Kingdom
Michele Nappi, University of Salerno, Italy
Fabio Narducci, University of Salerno, Italy
Maria Da Graça Pimentel, University of São Paulo, Brazil
Weisong Shi, University of Delaware, Wilmington, Delaware, USA

Associate Editors:
Ali Ahmad, 
Jazan University, Saudi Arabia
Sambit Bakshi, National Institute of Technology Rourkela, India
Carmen Bisogni, University of Salerno, Italy
Lucia Cascone, University of Salerno, Italy
Hanlin (Julia) Chen, Purdue University, Indiana, USA
Wei Cheng, University of Washington, Tacoma, Washington, USA
Stefano Cirillo, University of Salerno, Italy
Cecilia Di Ruberto, University of Cagliari, Italy 
Nagaraj V Dharwadkar, Central University of Karnataka, Kalaburgi, India
Song Fu, University of North Texas, Denton, Texas, USA
Marco Furini, Universita di Modena e Reggio Emilia, Italy
Ombretta GaggiUniversity of Padua, Italy
Chiara Galdi, EURECOM, Sophia Antipolis, France
Quanxue Gao, Xidian University, China
Carlos Gonzalez Morcillo, University of Castilla-La Mancha, Spain

Alfonso Guarino, University of Sannio, Italy
Abhishek Gupta, CSIR - Central Scientific Instruments Organisation, India
Yining Hua, University of Aberdeen, UK
Jun Kong, North Dakota State University, USA
Andrej Košir, University of Ljubljana, Faculty of Electrical Engineering, Slovenia
Wenjia Li, University of Nebraska-Lincoln, USA
Zechao Li, Nanjing University of Science and Technology, China
Xin Liao, Hunan University, China
Chen Liu, Clarkson University, USA
Dongfang LiuRochester Institute of Technology, Rochester, New York, USA
Qiang Liu, University of Nebraska-Lincoln, Nebraska, USA
Yi Liu, Changzhou University, China
Yuhong Liu, Santa Clara University, USA
Khoa LuuUniversity of Arkansas, Arkansas, USA
Viviana Cocco Mariani, Federal University of Paraná (UFPR), Brazil
Malaya Nath, NIT PUDUCHERRY, India
Weizhi Nie, Tianjin University, China
Chiara Pero, University of Salerno, Italy
Giuseppe Placidi, University of L'Aquila, Italy
Matteo Polsinelli, University of Salerno, Italy
Imad Rida, Université de Technologie de Compiègne, France
Antonio M. Rinaldi, University of Naples Federico II, Italy

Kewei Sha, University of North Texas, Texas, USA
Geetam Tomar, Rajkiya Engineering College, Sonbhadra, India
Somanath Tripathy, Indian Institute of Technology Patna, India
Haoxin Wang, Georgia State University, USA
Jianping WangCity University of Hong Kong, China
Ruijun Wang, Ford Motor Company, USA
Qi Wang, Northwestern Polytechnical University, China
Ken Yang, AECOM, USA
Shuangming Yang, Tianjin University, China
Dewei Yi, University of Aberdeen, UK
Rocco Zaccagnino, Università degli studi di Salerno, Italy 
Qiang Zhang, Xidian University, China 
Yulun Zhang, ETH Zürich, Switzerland
Tianfei Zhou, ETH Zürich, Switzerland


Editorial Board:
Marios C. Angelides, Brunel University London, United Kingdom
Marco Anisetti, University of Milano, Italy
Andrew Bagdanov, University of Florence, Italy
Lamberto Ballan, Stanford University, California, USA
Jenny Benois-Pineau, University of Bordeaux, France
Marco Bertini, University of Florence, Italy
Bharat Bhargava, Purdue University, Indiana, USA
Alberto del Bimbo, Università di Firenze, Italy
Susanne Boll, University of Oldenburg, Germany
Ying Cai, Iowa State University, Ames, Iowa, USA
Aniello Castiglione, University of Naples, Italy
Pablo Cesar, Centrum Wiskunde & Informatica, Netherlands
Amit Chakraborthy, Siemens Corporate Research, USA
Shu-Ching Chen, Florida International University, Miami, Florida, USA
Tat-Seng Chua, National University of Singapore
Ernesto Damiani, University of Milano, Italy
Antitza Dantcheva, INRIA, France
Chabane Djeraba, LIFL Laboratory, France
Schahram Dustdar, Vienna University of Technology, Wien, Austria
Abdulmotaleb El Saddik, University of Ottawa, Canada
Ben Falchuk, Vencore Labs, USA
David C. Gibbon, AT&T Labs - Research, USA
Yihong Gong, NEC, USA
Sonja Grgic, University of Zagreb, Croatia
Kien A. Hua, University of Central Florida, Florida, USA
Benoit Huet, Institut Eurecom, France
Horace H.S. Ip, City University of Hong Kong, China
Ebroul Izquierdo, Queen Mary, University of London, United Kingdom
Ramesh Jain, University of California, Irvine, California, USA
Rongrong Ji, Xiamen University, China
Shuqiang Jiang, Chinese Academy of Sciences, China
Hari Kalva, Florida Atlantic University, Boca Raton, Florida, USA
Shunsuke Kamijo, University of Tokyo, Japan
Ahmed Karmouch, University Ottawa, Canada
Harald Kosch, University of Passau, Germany
Clement Leung, Hong Kong Baptist University, Hong Kong
T.D.C. Little, Boston University, Massachusetts, USA
Huadong Ma, Beijing University of Posts & Telecommunications, PR of China
Hong Man, Stevens Institute of Technology, Hoboken, New Jersey, USA
Liam M. Mayron, Florida Institute of Technology, Florida, USA
Vincent Oria, New Jersey Institute of Technology, New Jersey, USA
Charles B. Owen, Michigan State University, Michigan, USA
Dragutin Petkovic, San Francisco State University, California, USA
Giuseppe Polese, University of Salerno, Italy
Jorge Posada, Vicomtech Research Centre, Spain
B. Prabhakaran, University of Texas at Dallas, Texas, USA
Martin Reisslein, Arizona State University, Tempe, Arizona, USA
Marco Roccetti, University of Bologna, Italy
Simone Santini, University of California at San Diego, California, USA
Shin'ichi Satoh, National Institute of Informatics, Tokyo, Japan
Klaus Schöffmann, Klagenfurt University, Austria
Lorenzo Seidenari, University of Florence, Italy
Ali Asghar Nazari Shirehjini, Karlsruhe Institute of Technology, Germany
Scott M. Stevens, SEI, Carnegie Mellon University, Pennsylvania, USA
Jinhui Tang, Nanjing University of Science and Technology, P.R. China
Yoshiyasu Takefuji, Keio University, Japan
Christian Timmerer, Klagenfurt University, Austria
Tiberio Uricchio, University of Florence, Italy
Jingdong Wang, Microsoft Research Asia, China
Meng Wang, Hefei University of Technology, China
Lars Wolf, Technical University Braunschweig, Germany
Changsheng Xu, NLPR, Chinese Academy of Sciences, China
Hanwang Zhang, National University of Singapore, Singapore
Zhiyong Zhang, Henan University of Science and Technology, China
Roger Zimmermann, National University of Singapore, Singapore
Ce Zhu, Nanyang Technological University, Singapore

Navigation