Editors

Editor:

Kaveh Pahlavan
Electrical & Computer Engineering Dept., Worcester Polytechnic Institute, MA, USA

Advisory Board:

A. H. Aghvami, King's College, London, UK; Donald C. Cox, Stanford University, CA; David D. Falconer, Carleton University, Ottawa, ON, Canada; David J. Goodman, Polytechnic Institute of New York University, NY; Shuzo Kato, NICT, Japan; Mohsen Kavehrad, Pennsylvania State University, University Park, PA; Tero Ojanpera, Nokia, Helsinki, Finland; Michael B. Pursley, Clemson University, SC ; Theodore S. Rappaport, Polytechnic Institute of New York University, NY; Andrew J. Viterbi, Qualcomm Inc., San Diego, CA

Associate Editors:

Emmanuel Agu, Worcester Polytechnic Institute, Worcester, MA; Hanan Al-TousAalto University, Espoo, FinlandGerard Chalhoub, Universite Clermont Auvergne, Aubiere, France; Andrew Clark, Worcester, Polytechnic Institute, Worcester, MA; Shihong Duan, University of Science and Technology of Beijing, China; Hamed Farhadi, Ericsson, Stockholm, Sweden; Jie He, University of Science and Technology, Beijing, ChinaSassan IrajiIntel, Munich, GermanyRutvij H. Jhaveri, Nanyang Technological University, Singapore; Abdallah Khreishah, New Jersey Institute of Technology, Newark, NJ; Saru Kumari, Chaudhary Charan Singh University, Meerut, India; Xinrong Li, University of North Texas, Denton, TXAlbena Mihovska, BTECH, Aarhus University, Denmark; Yongtao MA, Tianjin University, Tianjin, ChinaPeshal Nayak, Samsung Research America, TXKamran Sayrafian, NIST, Gaithersburg, MDAhmad Sharafat, TMU, Tehran, Iran; Shabnam Sodagari, CSU, Long Beach, CA; Erin SoloveyWorcester Polytechnic Institute, MA; Cheng Xu, University of Science and Technology Beijing, China; Reza Zekavat, Michigan Technological University, Houghton, MI

 

Editorial Board:

Jorgen Bach Andersen, Aalborg University, Denmark; Kwang-Cheng Chen, National Taiwan University, Taipai, Taiwan; Pierre R. Chevillat, IBM Zurich Research Laboratory, Switzerland;  Rajamani Ganesh, QUALCOMM, CA; Larry J. Greenstein, WINLAB, Rutgers University, NJ; Bijan Jabbari, George Mason University, Fairfax, VARyuji Kohno, Yokohama National University, Japan; Pentti Leppanen, University of Oulu, Finland; Allen H. Levesque, GPL Communications, Inc., Chelmsford, MARaymond L. Pickholtz, George Washington University, Washington, D.C.; Ramjee Prasad, Aalborg University, Denmark; John G. Proakis, Northeastern University, Boston, MA; Kazem Sohraby, University of Arkansas, Fayetteville, AK; Elvino S. Sousa, University of Toronto, ON, Canada; Desmond P. Taylor, University of Canterbury, Christchurch, New Zealand; Zoran Zvonar, MediaTek Wireless Technology, Woburn, MA