Semiconductor Advanced Packaging

Authors: Lau, John H.

Free Preview
  • Addresses advanced semiconductor packaging both in theory and practice
  • Comprehensively studies design, materials, process, fabrication, and reliability of various advanced semiconductor packaging technologies
  • Provides in-depth treatment of packaging technologies
see more benefits

Buy this book

eBook 117,69 €
price for India (gross)
  • ISBN 978-981-16-1376-0
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 149,99 €
price for India (gross)
  • ISBN 978-981-16-1375-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
About this book

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

About the authors

John H. Lau, Ph.D., P.E. has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong for 5 years; a specialist of the Industrial Technology Research Institute in Taiwan for 4½ years and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California for more than 25 years. He earrned a Ph.D. degree in theoretical and applied mechanics from the University of Illinois at Urbana–Champaign.With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, and given more than 300 lectures/workshops/keynotes worldwide. He has authored or coauthored 20 textbooks on fan-out wafer-level packaging, 3D IC heterogeneous integration and packaging, TSV for 3D integration, advanced MEMS packaging, reliability of 2D and 3D IC interconnects, flip chip, WLP, MCM, area-array packages, WLCSP, high-density PCB, SMT, DCA, TAB, lead-free materials, soldering, manufacturing, and solder joint reliability.

He has received many awards from the American Society of Mechanical Engineers (ASME), the Institute of Electrical and Electronics Engineers (IEEE), the Society of Manufacturing Engineers (SME) and other societies. He is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME’s, IEEE’s, and IMAPS’ technical activities.

Table of contents (11 chapters)

Table of contents (11 chapters)

Buy this book

eBook 117,69 €
price for India (gross)
  • ISBN 978-981-16-1376-0
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 149,99 €
price for India (gross)
  • ISBN 978-981-16-1375-3
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Covid-19 shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
Loading...

Services for this Book

Bibliographic Information

Bibliographic Information
Book Title
Semiconductor Advanced Packaging
Authors
Copyright
2021
Publisher
Springer Singapore
Copyright Holder
The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
eBook ISBN
978-981-16-1376-0
DOI
10.1007/978-981-16-1376-0
Hardcover ISBN
978-981-16-1375-3
Edition Number
1
Number of Pages
XXII, 498
Number of Illustrations
27 b/w illustrations, 530 illustrations in colour
Topics