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Industrial Applications of Adhesives

1st International Conference on Industrial Applications of Adhesives

  • Conference proceedings
  • © 2021

Overview

Editors:
  1. Lucas F. M. da Silva

    1. Department of Mechanical Engineering, Faculdade de Engenharia, University of Porto, Porto, Portugal

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  2. Robert D. Adams

    1. Department of Mechanical Engineering, University of Bristol, Bristol, UK

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  3. Chiaki Sato

    1. Materials and Structures Laboratory (MSL), Tokyo Institute of Technology, Yokohama, Japan

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  4. Klaus Dilger

    1. Institut für Füge- und Schweißtechnik, Technische Universität Braunschweig, Braunschweig, Germany

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  • Presents the proceedings of the 1st International Conference on Industrial Applications of Adhesive, held in Funchal, Madeira
  • Covers a wide range of topics relating to adhesive curing for electronic and automotive industries
  • Serves as a reference resource for researchers and graduate students interested in adhesive bonding

Part of the book series: Lecture Notes in Mechanical Engineering (LNME)

Included in the following conference series:

Conference proceedings info: IAA 2020.

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Table of contents (7 papers)

  1. Front Matter

    Pages i-vii
    Download chapter PDF

  2. Use of UV-Curing Adhesive Systems on Non-transparent Joining Parts by Using Sidelight Activated Polymer Optical Fibres

    • R. Seewald, J. Kallweit, J. Weiland, A. Schiebahn, T. Gries, U. Reisgen
    Pages 1-14

  3. Some Industrial Examples of Accelerated Curing Using Curie Particles

    • Ahmed Elmahdy, Isabel Van de Weyenberg, Patrick Cosemans, Michael Adam, Morten Voß, Sascha Heinrichs et al.
    Pages 15-30

  4. Novel Torsion Machine to Test Adhesive Joints

    • M. A. Dantas, R. J. C. Carbas, A. M. Lopes, C. M. da Silva, E. A. S. Marques, L. F. M. da Silva
    Pages 31-56

  5. Development of an Elasto-plastic Meshless Technique to Analyse Bonded Structures

    • I. J. Sánchez-Arce, L. D. C. Ramalho, R. D. S. G. Campilho, J. Belinha
    Pages 57-77

  6. Techniques for the Mechanical Characterization and Numerical Modelling of Bonded Automotive Structures Under Impact Loads

    • E. A. S. Marques, P. D. P. Nunes, A. Akhavan-Safar, C. S. P. Borges, R. J. C. Carbas, J. J. M. Machado et al.
    Pages 79-106

  7. Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates

    • B. Nečasová, P. Liška, J. Šlanhof
    Pages 107-125

  8. Ageing Condition Determination of Bonded Joints by Terahertz Spectroscopy

    • Jochen Taiber, Martin Kahlmeyer, Andreas Winkel, Eva-Maria Stübling, Fatima Taleb, Mikhail Mikerov et al.
    Pages 127-138
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Keywords

About this book

This book gathers selected papers presented at the 1st International Conference on Industrial Applications of Adhesives 2020 (IAA 2020). It covers a wide range of topics, including adhesive curing for electronic and automotive industries; adhesive testing with a torsion machine for rigorous mechanical properties determination; joint design using innovative techniques such as the meshless method; design methodologies in the automotive industry for joints under impact; temperature effects in joints typically found in civil engineering; and advanced nondestructive techniques such as terahertz spectroscopy to assess the durability of adhesive joints. Providing a review of the state-of the art in industrial applications of adhesives, the book serves as a valuable reference resource for researchers and graduate students interested in adhesive bonding.

Editors and Affiliations

  • Department of Mechanical Engineering, Faculdade de Engenharia, University of Porto, Porto, Portugal

    Lucas F. M. da Silva

  • Department of Mechanical Engineering, University of Bristol, Bristol, UK

    Robert D. Adams

  • Materials and Structures Laboratory (MSL), Tokyo Institute of Technology, Yokohama, Japan

    Chiaki Sato

  • Institut für Füge- und Schweißtechnik, Technische Universität Braunschweig, Braunschweig, Germany

    Klaus Dilger

Bibliographic Information

  • Book Title: Industrial Applications of Adhesives

  • Book Subtitle: 1st International Conference on Industrial Applications of Adhesives

  • Editors: Lucas F. M. da Silva, Robert D. Adams, Chiaki Sato, Klaus Dilger

  • Series Title: Lecture Notes in Mechanical Engineering

  • DOI: https://doi.org/10.1007/978-981-15-6767-4

  • Publisher: Springer Singapore

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Nature Singapore Pte Ltd. 2021

  • Hardcover ISBN: 978-981-15-6766-7Published: 23 July 2020

  • Softcover ISBN: 978-981-15-6769-8Published: 24 July 2021

  • eBook ISBN: 978-981-15-6767-4Published: 22 July 2020

  • Series ISSN: 2195-4356

  • Series E-ISSN: 2195-4364

  • Edition Number: 1

  • Number of Pages: VII, 138

  • Number of Illustrations: 32 b/w illustrations, 67 illustrations in colour

  • Topics: Solid Mechanics, Tribology, Corrosion and Coatings, Polymer Sciences, Manufacturing, Machines, Tools, Processes

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