Highlights in Electrical Engineering 2017
Looking back at the past year to inspire the future
Looking back at the past year to inspire the future
2017 was a year filled with groundbreaking research and technological advances. As we start 2018, we would like to take a look back and reflect on some of the most popular research from 2017, sourced from our Book and Journal portfolio to inspire us for 2018.
Read on to find the most downloaded research of 2017
2017 was full of political threads and natural hazards so that one of my friends looked back on 2017 and found it an “annus horribilis”. However, 2017 was also a year full of technological breakthroughs and innovations. Many of them will improve life, and a big portion of the innovation was created by electrical engineers. Brain implants will restore the capabilities of paralyzed patients to move, hot solar cells could be able to create cheap and continuous power, and of course the Internet of Things will reach every corner of our daily life.
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We at Springer Nature feature all of these innovations in over 350 books in electrical engineering and countless articles that we published in 2017. However, engineering has become multidisciplinary discipline and the new fields are emerging that require innovators to look far beyond traditional boundaries of engineering. One essential trend is "The Internet of Things" - the ability to interconnect physical objects of all kinds with other objects using wireless technologies, which is heavily electronics engineering related and is dominating the discussion of future technologies.
Here, I want to highlight a few outstanding publications that must be on the table of every scientist in the field. Almost all sub-disciplines of electrical engineering are involved when we look at the development of the Internet of Things. Many people believe that everything will turn in to Internet of Things, and without any doubt, IoT has already started to change the industrial processes and labor work. If you are searching for an introduction into the IoT-technology from integrated circuits to integrated systems you might want to read the book “Enabling the Internet of Things” by Massimo Alioto. Essential technological ingredients enabling IoT range from fundamental semiconductor technologies through circuits, and wireless systems to high-end information technology challenge, like data security and privacy. In 2017 we published essential readers to all of these. Some examples: On the semi-conductor level we offered “Outlook and Challenges of Nano Devices, Sensors, and MEMS”, edited by Ting Li and Zhiwei Liu. This book provides you with an overview on the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. Dharma Prakash Agrawal’s “Embedded Sensor Systems” is an essential introduction to wireless technologies for sensors and has a look at sensor networks as an integral component of the IoT.
On the Information Technology level of IoT, Tomlinson, Tjhai, Ambroze, Ahmed, and Jibril wrote a book on self-correcting data. “Error-Correction Coding and Decoding” shows the application of these codes in a wide range of everyday technologies, from smartphones to secure communications and transactions.
However, IoT will go much beyond industrial processes. Networks of things, people, and processes are presently creating a new paradigm: the Internet of Everything. Batalla, Mastorakis, Mavromoustakis, and Pallis have accepted the challenge to prepare the research community for IoE in their book “Beyond the Internet of Things”.
IoT will change our lives and it will also enable Electrical Engineers to tackle several future challenges. I just want to mention a few buzz-words: Smart Cities, Autonomous Driving, Smart Power Grids, Industry 4.0, and many more.
The technology of illuminating things is brought to us by the editors Robert Karlicek, Ching-Cherng, Sun, Georges Zissis,and Ruiqing Ma with their reference work The Handbook of Advanced Lighting Technology. This reference explains the basic physical principles and device technologies behind all light source types, especially LEDs and OLEDs. Another essential book for the semiconductor industry has been put together as “3D Microelectronic Packaging” by Yan Li and Deepak Goyal. Although the technology goes back to the established principles of William Shockley, through-silicon via (TSV) and 3D packaging is now increasingly used in the semiconductor industry to pack micro- and nanoelectronic circuits.
For me, 2017 was the year of Internet of Things and Information Technologies, their security and privacy challenges as well as their opportunity to make our lives easier. So, I am looking forward to more innovations in 2018, invented by electrical engineering, and I hope that our program will inspire you to tackle the future challenges.
Christoph Baumann is Executive Editor for Applied Sciences.
Electrical and Computer Engineering; Circuits and Systems; Design Automation; Embedded Systems; Computer Architecture