Ductile Mode Cutting of Brittle Materials
Authors: Liu, Kui, Wang, Hao, Zhang, Xinquan
Free Preview- Provides insights into the fundamental mechanism in ductile mode cutting of brittle materials such as silicon, glass, tungsten carbide, and calcium fluoride
- Introduces advanced hybrid machining processes such as ultrasonic vibration and thermal- assisted machining to enhance machinability
- Presents comprehensive modeling and molecular dynamic simulation of the new ductile mode cutting manufacturing processes
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- About this book
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This book provides a systematic and comprehensive interdisciplinary overview of ductile mode cutting of brittle materials, covering a range of topics from the fundamental physics to engineering practices. Discussing the machining mechanics and material properties, it explains the fundamental mechanism of ductile-to-brittle transition in the cutting of brittle materials. It also presents theoretical modeling and molecular dynamic simulation to demonstrate that ductile mode cutting can be achieved under certain conditions, as well as extensive experimental studies that produced smooth and damage-free surfaces on different materials, such as silicon, glass, tungsten carbide and calcium fluoride. Lastly, it explores how the ductile mode cutting performance and machinability of brittle materials can be further improved by hybrid machining processes like ultrasonic vibration and thermal-assisted cutting technologies in order to meet industry demands.
- About the authors
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- Reviews
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- Table of contents (14 chapters)
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Introduction
Pages 1-14
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Ductile Mode Cutting Mechanism
Pages 17-37
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Ductile Mode Cutting Characteristics
Pages 39-53
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Modelling of Ductile Mode Cutting
Pages 55-73
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Molecular Dynamics Simulation of Ductile Mode Cutting
Pages 75-99
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Table of contents (14 chapters)
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Bibliographic Information
- Bibliographic Information
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- Book Title
- Ductile Mode Cutting of Brittle Materials
- Authors
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- Kui Liu
- Hao Wang
- Xinquan Zhang
- Series Title
- Springer Series in Advanced Manufacturing
- Copyright
- 2020
- Publisher
- Springer Singapore
- Copyright Holder
- Springer Nature Singapore Pte Ltd.
- eBook ISBN
- 978-981-329-836-1
- DOI
- 10.1007/978-981-32-9836-1
- Hardcover ISBN
- 978-981-329-835-4
- Series ISSN
- 1860-5168
- Edition Number
- 1
- Number of Pages
- XXIV, 291
- Topics
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