Transactions on Engineering Technologies
25th World Congress on Engineering (WCE 2017)
Editors: Ao, Sio-Iong, Gelman, Len, Kim, Haeng Kon (Eds.)
Free Preview- This volume contains revised and extended research articles written by prominent researchers participating in the conference
- The volume offers the state of art of tremendous advances in engineering technologies and physical science and applications
- The volume also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science and applications
Buy this book
- About this book
-
This volume contains a selection of revised and extended research articles written by prominent researchers participating in a large international conference on Advances in Engineering Technologies and Physical Science which was held in London, UK, 5-7 July, 2017. Topics covered include mechanical engineering, engineering mathematics, computer science, knowledge engineering, electrical engineering, wireless networks, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book offers the state of art in engineering technologies and physical science and applications, and also serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science and applications.
- About the authors
-
Dr. Sio-Iong Ao finished his doctoral research in The University of Hong Kong and postdoctoral researches in the University of Oxford and Harvard University and is a former visiting professor of Cranfield University, UK and University of Wyoming, USA.
Prof. Len Gelman is Professor and Chair in Signal Processing and Condition Monitoring, and Director, the Centre for Efficiency and Performance Engineering, School of Computing and Engineering, The University of Huddersfield, UK. He has more than 25 year’s experience in signal processing and vibro-acoustic monitoring of complex mechanical systems (e.g. rotating, reciprocating machinery, etc.) both in industry and academia. He has been Principal Investigator on numerous contracts and grants, including grants from the USA National Academy of Sciences, USA National Research Council, USA International Science Foundation, USA Civilian Research and Development Foundation (twice), USA MacArthur Foundation, Lady Davis, Israel, Centro Volta, Italy. He is Principal Investigator on UK EPSRC, UK DTI (three times), UK Royal Society, Rolls Royce (two times) and Shell grants.
Dr. Haeng-Kon Kim is currently a Dean of engineering college and a professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA center in U.S.A. He has taught in Central Michigan Univ. in U.S.A. during his Sabbatical (Dec., 20, 2000 ~ Feb., 20,2002).
- Table of contents (30 chapters)
-
-
Homogenization of Electromagnetic Fields Propagation in a Composite
Pages 1-15
-
Statistics of Critical Load in Arrays of Nanopillars on Nonrigid Substrates
Pages 17-29
-
Quantifying the Impact of External Shocks on Systemic Risks for Russian Companies Using Risk Measure
Pages 31-42
-
An Innovative DSS for the Contingency Reserve Estimation in Stochastic Regime
Pages 43-57
-
A Simulation Study on Indoor Location Estimation Based on the Extreme Radial Weibull Distribution
Pages 59-70
-
Table of contents (30 chapters)
Recommended for you
Bibliographic Information
- Bibliographic Information
-
- Book Title
- Transactions on Engineering Technologies
- Book Subtitle
- 25th World Congress on Engineering (WCE 2017)
- Editors
-
- Sio-Iong Ao
- Len Gelman
- Haeng Kon Kim
- Copyright
- 2019
- Publisher
- Springer Singapore
- Copyright Holder
- Springer Nature Singapore Pte Ltd.
- eBook ISBN
- 978-981-13-0746-1
- DOI
- 10.1007/978-981-13-0746-1
- Hardcover ISBN
- 978-981-13-0745-4
- Softcover ISBN
- 978-981-13-4490-9
- Edition Number
- 1
- Number of Pages
- IX, 407
- Number of Illustrations
- 165 b/w illustrations
- Topics
