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Photonic Packaging Sourcebook

Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

  • Book
  • © 2015

Overview

Authors:
  1. Ulrich H. P. Fischer-Hirchert

    1. Photonics Communications Lab, Harz University of Applied Sciences, Wernigerode, Germany

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  • Provides an overview of today's state-of-the-art technologies
  • Guides the reader through the practical use of optical connectors
  • Presents effective and inexpensive set-up for engineers' needs
  • Illustrates recent reliability test procedures for datacom and telecom modules in combination with related standardization aspects
  • Includes supplementary material: sn.pub/extras

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Table of contents (13 chapters)

  1. Front Matter

    Pages i-xix
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  2. Introduction into Photonic Packaging

    • Ulrich H. P. Fischer-Hirchert
    Pages 1-21

  3. Optical Waveguides

    • Ulrich H. P. Fischer-Hirchert
    Pages 23-55

  4. Optical Mode-field Adaptation

    • Ulrich H. P. Fischer-Hirchert
    Pages 57-76

  5. Fiber-Optical Coupling

    • Ulrich H. P. Fischer-Hirchert
    Pages 77-109

  6. RF Lines

    • Ulrich H. P. Fischer-Hirchert
    Pages 111-131

  7. Soldering, Adhesive Bonding, and Bonding

    • Ulrich H. P. Fischer-Hirchert
    Pages 133-147

  8. Optical Connection Technology

    • Ulrich H. P. Fischer-Hirchert
    Pages 149-165

  9. Active Adjustment Techniques

    • Ulrich H. P. Fischer-Hirchert
    Pages 167-192

  10. Passive Adjustment Techniques

    • Ulrich H. P. Fischer-Hirchert
    Pages 193-216

  11. Optical Motherboard

    • Ulrich H. P. Fischer-Hirchert, Ulrich Krzysztof Nieweglowski
    Pages 217-239

  12. Fiber Optic Modules

    • Ulrich H. P. Fischer-Hirchert
    Pages 241-268

  13. From Chip Design to the Optimum Package

    • Ulrich H. P. Fischer-Hirchert
    Pages 269-307

  14. Reliability Tests

    • Ulrich H. P. Fischer-Hirchert
    Pages 309-318

  15. Back Matter

    Pages 319-325
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Keywords

About this book

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Authors and Affiliations

  • Photonics Communications Lab, Harz University of Applied Sciences, Wernigerode, Germany

    Ulrich H. P. Fischer-Hirchert

About the author

Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.

Bibliographic Information

  • Book Title: Photonic Packaging Sourcebook

  • Book Subtitle: Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules

  • Authors: Ulrich H. P. Fischer-Hirchert

  • DOI: https://doi.org/10.1007/978-3-642-25376-8

  • Publisher: Springer Berlin, Heidelberg

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer-Verlag Berlin Heidelberg 2015

  • Hardcover ISBN: 978-3-642-25375-1Published: 22 April 2015

  • Softcover ISBN: 978-3-662-52135-9Published: 09 October 2016

  • eBook ISBN: 978-3-642-25376-8Published: 11 April 2015

  • Edition Number: 1

  • Number of Pages: XIX, 325

  • Number of Illustrations: 271 b/w illustrations, 16 illustrations in colour

  • Topics: Microwaves, RF and Optical Engineering, Nanotechnology and Microengineering, Circuits and Systems

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