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Ultra-thin Chip Technology and Applications

Editors: Burghartz, Joachim (Ed.)

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  • Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications
  • Features the work of leaders in the field who share their newest results and ideas
  • Compares strengths and weaknesses of three leading, generic fabrication processes for ultra-thin chips Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips
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eBook 117,69 €
price for Spain (gross)
  • ISBN 978-1-4419-7276-7
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 155,99 €
price for Spain (gross)
  • ISBN 978-1-4419-7275-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 155,50 €
price for Spain (gross)
  • ISBN 978-1-4939-5118-5
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  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
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About this book

Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology.

Table of contents (34 chapters)

Table of contents (34 chapters)

Buy this book

eBook 117,69 €
price for Spain (gross)
  • ISBN 978-1-4419-7276-7
  • Digitally watermarked, DRM-free
  • Included format: EPUB, PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 155,99 €
price for Spain (gross)
  • ISBN 978-1-4419-7275-0
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 155,50 €
price for Spain (gross)
  • ISBN 978-1-4939-5118-5
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Rent the eBook  
  • Rental duration: 1 or 6 month
  • low-cost access
  • online reader with highlighting and note-making option
  • can be used across all devices
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Bibliographic Information

Bibliographic Information
Book Title
Ultra-thin Chip Technology and Applications
Editors
  • Joachim Burghartz
Copyright
2011
Publisher
Springer-Verlag New York
Copyright Holder
Springer Science+Business Media, LLC
eBook ISBN
978-1-4419-7276-7
DOI
10.1007/978-1-4419-7276-7
Hardcover ISBN
978-1-4419-7275-0
Softcover ISBN
978-1-4939-5118-5
Edition Number
1
Number of Pages
XXII, 467
Topics