Interconnect Technology and Design for Gigascale Integration

Editors: Davis, Jeffrey A., Meindl, James D. (Eds.)

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  • ISBN 978-1-4615-0461-0
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About this book

Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T.J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.

Table of contents (10 chapters)

Table of contents (10 chapters)

Buy this book

eBook 96,29 €
price for Spain (gross)
  • ISBN 978-1-4615-0461-0
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • Immediate eBook download after purchase and usable on all devices
  • Bulk discounts available
Hardcover 166,39 €
price for Spain (gross)
Softcover 124,79 €
price for Spain (gross)
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Bibliographic Information

Bibliographic Information
Book Title
Interconnect Technology and Design for Gigascale Integration
Editors
  • Jeffrey A. Davis
  • James D. Meindl
Copyright
2003
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4615-0461-0
DOI
10.1007/978-1-4615-0461-0
Hardcover ISBN
978-1-4020-7606-0
Softcover ISBN
978-1-4613-5088-0
Edition Number
1
Number of Pages
XIII, 411
Topics