Microsystems

Materials & Process Integration for MEMS

Editors: Tay, Francis E. H. (Ed.)

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About this book

The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high­ volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.

Table of contents (14 chapters)

Table of contents (14 chapters)
  • Integration of Piezoelectric Pb(Zr

    Pages 1-24

    Muralt, Paul (et al.)

  • Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding

    Pages 25-50

    Prochaska, A. (et al.)

  • GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs

    Pages 51-75

    Lalinsky, T. (et al.)

  • Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications

    Pages 77-96

    Fu, Yongqing (et al.)

  • Chemically Amplified Resist for Micromachining Using X-Ray Lithography

    Pages 97-111

    Tan, T. L. (et al.)

Buy this book

eBook 160,49 €
price for Spain (gross)
  • ISBN 978-1-4757-5791-0
  • Digitally watermarked, DRM-free
  • Included format: PDF, EPUB
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 207,99 €
price for Spain (gross)
  • ISBN 978-1-4020-7175-1
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 207,99 €
price for Spain (gross)
  • ISBN 978-1-4419-5303-2
  • Free shipping for individuals worldwide
  • Institutional customers should get in touch with their account manager
  • Shipping restrictions
  • Usually ready to be dispatched within 3 to 5 business days, if in stock
  • The final prices may differ from the prices shown due to specifics of VAT rules
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Bibliographic Information

Bibliographic Information
Book Title
Materials & Process Integration for MEMS
Editors
  • Francis E. H. Tay
Series Title
Microsystems
Series Volume
9
Copyright
2002
Publisher
Springer US
Copyright Holder
Springer Science+Business Media New York
eBook ISBN
978-1-4757-5791-0
DOI
10.1007/978-1-4757-5791-0
Hardcover ISBN
978-1-4020-7175-1
Softcover ISBN
978-1-4419-5303-2
Series ISSN
1389-2134
Edition Number
1
Number of Pages
XIX, 299
Topics