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Solid Mechanics and Its Applications

IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials

Proceedings of the IUTAM Symposium held in Beijing, China, June 27-30, 2005

Editors: Bai, Y.L., Zheng, Q.S., Wei, Y.G. (Eds.)

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  • ISBN 978-1-4020-5624-6
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Hardcover 176,79 €
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  • ISBN 978-1-4020-5623-9
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Softcover 124,79 €
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  • ISBN 978-90-481-7411-9
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Table of contents (24 chapters)

Table of contents (24 chapters)
  • Mesoscopic Modeling of the Deformation and Fracture of Nanocrystalline Metals

    Pages 3-10

    Anand, Lallit (et al.)

  • Dislocation-Assisted Grain Growth in Nanocrystalline Copper under Large Deformation

    Pages 11-18

    Ma, X. L. (et al.)

  • Microstructure and Tensile Strength of Cu with Nano-Scale Twins

    Pages 19-24

    Shen, Y. F. (et al.)

  • Microstructural Evolution in Crystalline Metal Induced by Plastic Deformation

    Pages 25-35

    Nakatani, A. (et al.)

  • The Origin of Superhardness in Nanocomposite Coatings: Analysis of Nanoindentation and Scratch Tests

    Pages 39-49

    Lu, Chunsheng (et al.)

Buy this book

eBook 101,14 €
price for Spain (gross)
  • ISBN 978-1-4020-5624-6
  • Digitally watermarked, DRM-free
  • Included format: PDF
  • ebooks can be used on all reading devices
  • Immediate eBook download after purchase
Hardcover 176,79 €
price for Spain (gross)
  • ISBN 978-1-4020-5623-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
Softcover 124,79 €
price for Spain (gross)
  • ISBN 978-90-481-7411-9
  • Free shipping for individuals worldwide
  • Usually dispatched within 3 to 5 business days.
  • The final prices may differ from the prices shown due to specifics of VAT rules
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Bibliographic Information

Bibliographic Information
Book Title
IUTAM Symposium on Mechanical Behavior and Micro-Mechanics of Nanostructured Materials
Book Subtitle
Proceedings of the IUTAM Symposium held in Beijing, China, June 27-30, 2005
Editors
  • Y.L. Bai
  • Q.S. Zheng
  • Y.G. Wei
Series Title
Solid Mechanics and Its Applications
Series Volume
144
Copyright
2007
Publisher
Springer Netherlands
Copyright Holder
Springer Science+Business Media B.V.
eBook ISBN
978-1-4020-5624-6
DOI
10.1007/978-1-4020-5624-6
Hardcover ISBN
978-1-4020-5623-9
Softcover ISBN
978-90-481-7411-9
Series ISSN
0925-0042
Edition Number
1
Number of Pages
XVI, 261
Topics