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  • Book
  • © 1997

Microelectronics Packaging Handbook

Semiconductor Packaging

Editors:

  1. Rao R. Tummala

    1. Georgia Institute of Technology, USA

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    You can also search for this editor in PubMed   Google Scholar

  2. Eugene J. Rymaszewski

    1. Rensselaer Polytechnic Institute, USA

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

  3. Alan G. Klopfenstein

    1. AGK Enterprises, USA

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    You can also search for this editor in PubMed   Google Scholar

Sections

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Table of contents (8 chapters)

  1. Front Matter

    Pages i-xxxv
    PDF

  2. Microelectronics Packaging Handbook: Semiconductor Packaging

    1. Front Matter

      Pages 1-1
      PDF

    2. Microelectronics Packaging—An Overview

      • Eugene J. Rymaszewski, Rao R. Tummala, Toshihiko Watari
      Pages 3-128

    3. Chip-To-Package Interconnections

      • Paul A. Totta, Subash Khadpe, Nicholas G. Koopman, Timothy C. Reiley, Michael J. Sheaffer
      Pages 129-283

    4. Ceramic Packaging

      • Rao R. Tummala, Phil Garrou, Tapan Gupta, N. Kuramoto, Koichi Niwa, Yuzo Shimada et al.
      Pages 284-393

    5. Plastic Packaging

      • Michael G. Pecht, Luu T. Nguyen
      Pages 394-508

    6. Polymers in Packaging

      • G. Czornyj, M. Asano, R. L. Beliveau, P. Garrou, H. Hiramoto, A. Ikeda et al.
      Pages 509-623

    7. Thin-Film Packaging

      • Rao Tummala, Weiping Li, Ted Tessier, Tom Wassick
      Pages 624-813

    8. Package Electrical Testing

      • Madhavan Swaminathan, Abhijit Chatterjee, Frank Crnic, Bruce C. Kim, Koppolu Sasidhar
      Pages 814-872

    9. Package Sealing and Encapsulation

      • C. P. Wong, D. B. Clegg, Ananda H. Kumar, K. Otsuka, Berhan Ozmat
      Pages 873-930

  3. Back Matter

    Pages 931-1030
    PDF
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About this book

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool­ ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
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Reviews

`A most comprehensive book set, both well presented and well illustrated.'
IEEE Electrical Insulation Magazine, September/October 1997
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Editors and Affiliations

  • Georgia Institute of Technology, USA

    Rao R. Tummala

  • Rensselaer Polytechnic Institute, USA

    Eugene J. Rymaszewski

  • AGK Enterprises, USA

    Alan G. Klopfenstein

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Bibliographic Information

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Buy it now

eBook USD 299.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book USD 379.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

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