- Provides a comprehensive summary of the most recent advances in materials development for advanced packaging
- Covers emerging technologies such as digital health, bio-medical, and nano-materials/processing, in addition to microelectronic and optoelectronic packaging
- Discusses various types of materials including polymers, ceramics, metals, and solders
- Each chapter written by industry leaders
Buy this book
- About this book
-
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
- Table of contents (19 chapters)
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3D Integration Technologies – An Overview
Pages 1-50
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Advanced Bonding/Joining Techniques
Pages 51-76
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Advanced Chip-to-Substrate Connections
Pages 77-112
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Advanced Wire Bonding Technology: Materials, Methods, and Testing
Pages 113-179
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Lead-Free Soldering
Pages 181-218
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Table of contents (19 chapters)
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Bibliographic Information
- Bibliographic Information
-
- Book Title
- Materials for Advanced Packaging
- Editors
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- Daniel Lu
- C.P. Wong
- Copyright
- 2009
- Publisher
- Springer US
- Copyright Holder
- Springer-Verlag US
- eBook ISBN
- 978-0-387-78219-5
- DOI
- 10.1007/978-0-387-78219-5
- Hardcover ISBN
- 978-0-387-78218-8
- Edition Number
- 1
- Number of Pages
- XII, 724
- Number of Illustrations
- 300 b/w illustrations
- Topics