Solder Joint Technology
Materials, Properties, and Reliability
Authors: Tu, King-Ning
Free Preview- Addresses the urgent need for reliable, lead-free solders in electronic manufacturing
- Reviews the basic science of copper-tin reactions and electromigration
- Emphasizes reliability issues related to solder joint reaction and electromigration-induced failure in consumer electronics and computers
- Suggests improvements in solder joint reliability and the science of solder joint behavior
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- About this book
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Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.
- Table of contents (12 chapters)
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Introduction
Pages 1-33
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Copper–Tin Reactions in Bulk Samples
Pages 37-71
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Copper–Tin Reactions in Thin-Film Samples
Pages 73-109
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Copper–Tin Reactions in Flip Chip Solder Joints
Pages 111-125
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Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops
Pages 127-151
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Table of contents (12 chapters)
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Bibliographic Information
- Bibliographic Information
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- Book Title
- Solder Joint Technology
- Book Subtitle
- Materials, Properties, and Reliability
- Authors
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- King-Ning Tu
- Series Title
- Springer Series in Materials Science
- Series Volume
- 92
- Copyright
- 2007
- Publisher
- Springer-Verlag New York
- Copyright Holder
- Springer-Verlag New York
- eBook ISBN
- 978-0-387-38892-2
- DOI
- 10.1007/978-0-387-38892-2
- Hardcover ISBN
- 978-0-387-38890-8
- Softcover ISBN
- 978-1-4419-2284-7
- Series ISSN
- 0933-033X
- Edition Number
- 1
- Number of Pages
- XVI, 370
- Topics
