Skip to main content
SpringerLink
Log in
Book cover

Advanced Thermal Stress Analysis of Smart Materials and Structures

  • Book
  • © 2020

Overview

Authors:
  1. Zengtao Chen

    1. Department of Mechanical Engineering, University of Alberta, Edmonton, Canada

    View author publications

    You can also search for this author in PubMed   Google Scholar

  2. Abdolhamid Akbarzadeh

    1. Department of Bioresource Engineering, McGill University, Island of Montreal, Canada

    View author publications

    You can also search for this author in PubMed   Google Scholar

  • A first monograph on thermal stress analysis based on non-Fourier heat conduction theories
  • Includes applications of non-Fourier heat conduction in thermal stress analysis of smart materials and structures
  • Summarizies non-Fourier heat conduction theories, an emerging topic in thermal fluids

Part of the book series: Structural Integrity (STIN, volume 10)

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 109.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (7 chapters)

  1. Front Matter

    Pages i-x
    Download chapter PDF

  2. Heat Conduction and Moisture Diffusion Theories

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 1-22

  3. Basic Problems of Non-Fourier Heat Conduction

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 23-63

  4. Multiphysics of Smart Materials and Structures

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 65-117

  5. Coupled Thermal Stresses in Advanced Smart Materials

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 119-170

  6. Thermal Fracture of Advanced Materials Based on Fourier Heat Conduction

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 171-242

  7. Advanced Thermal Fracture Analysis Based on Non-Fourier Heat Conduction Models

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 243-302

  8. Future Perspectives

    • Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 303-304
Back to top

Keywords

About this book

This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. 

The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book  provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.

A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.       




Authors and Affiliations

  • Department of Mechanical Engineering, University of Alberta, Edmonton, Canada

    Zengtao Chen

  • Department of Bioresource Engineering, McGill University, Island of Montreal, Canada

    Abdolhamid Akbarzadeh

Bibliographic Information

  • Book Title: Advanced Thermal Stress Analysis of Smart Materials and Structures

  • Authors: Zengtao Chen, Abdolhamid Akbarzadeh

  • Series Title: Structural Integrity

  • DOI: https://doi.org/10.1007/978-3-030-25201-4

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer Nature Switzerland AG 2020

  • Hardcover ISBN: 978-3-030-25200-7Published: 19 September 2019

  • Softcover ISBN: 978-3-030-25203-8Published: 19 September 2020

  • eBook ISBN: 978-3-030-25201-4Published: 03 September 2019

  • Series ISSN: 2522-560X

  • Series E-ISSN: 2522-5618

  • Edition Number: 1

  • Number of Pages: X, 304

  • Number of Illustrations: 60 b/w illustrations, 44 illustrations in colour

  • Topics: Solid Mechanics, Characterization and Evaluation of Materials, Mathematical Modeling and Industrial Mathematics

Publish with us

Policies and ethics

Back to top

Search

Navigation