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Handbook of Advanced Plasma Processing Techniques

  • Book
  • © 2000

Overview

Editors:
  1. Randy J. Shul

    1. Sandia National Laboratories, Albuquerque, USA

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    You can also search for this editor in PubMed   Google Scholar

  2. Stephen J. Pearton

    1. Dept. Mat. Sci. Eng., University of Florida, Gainesville, USA

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    You can also search for this editor in PubMed   Google Scholar

  • This volume brings together some of the most well-known scientists in each of the topics covered, many of whom have pioneered the development of plasma processing techniques
  • Includes supplementary material: sn.pub/extras

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Table of contents (15 chapters)

  1. Front Matter

    Pages I-XVI
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  2. Some Fundamental Aspects of Plasma-Assisted Etching

    • J. W. Coburn
    Pages 1-32

  3. Plasma Fundamentals for Materials Processing

    • J. E. Stevens
    Pages 33-68

  4. Plasma Modeling

    • E. Meeks, P. Ho
    Pages 69-121

  5. Plasma Reactor Modeling

    • M. Meyyappan
    Pages 123-144

  6. Overview of Plasma Diagnostic Techniques

    • G. A. Hebner, P. A. Miller, J. R. Woodworth
    Pages 145-204

  7. Mass Spectrometric Characterization of Plasma Etching Processes

    • C. R. Eddy Jr.
    Pages 205-256

  8. Fundamentals of Plasma Process-Induced Charging and Damage

    • K. P. Giapis
    Pages 257-308

  9. Surface Damage Induced by Dry Etching

    • S. W. Pang
    Pages 309-360

  10. Photomask Etching

    • D. J. Resnick
    Pages 361-418

  11. Bulk Si Micromachining for Integrated Microsystems and MEMS Processing

    • R. J. Shul, J. G. Fleming
    Pages 419-458

  12. Plasma Processing of III-V Materials

    • C. Youtsey, I. Adesida
    Pages 459-505

  13. Ion Beam Etching of Compound Semiconductors

    • G. A. Vawter
    Pages 507-547

  14. Dry Etching of InP Vias

    • S. Thomas III, J. J. Brown
    Pages 549-573

  15. Device Damage During Low Temperature High-Density Plasma Chemical Vapor Deposition

    • J. Lee, F. Ren
    Pages 575-605

  16. Dry Etching of Magnetic Materials

    • K. B. Jung, H. Cho, S. J. Pearton
    Pages 607-647

  17. Back Matter

    Pages 649-655
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Keywords

About this book

Pattern transfer by dry etching and plasma-enhanced chemical vapor de­ position are two of the cornerstone techniques for modern integrated cir­ cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen­ sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi­ als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.

Editors and Affiliations

  • Sandia National Laboratories, Albuquerque, USA

    Randy J. Shul

  • Dept. Mat. Sci. Eng., University of Florida, Gainesville, USA

    Stephen J. Pearton

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