Overview
- Provides a comprehensive summary of current literature on lead-containing ceramic area array electronic package solder joining reliability
- Develops useful and easy-to-use tools for predicting solder joint fatigue life under thermal cycling and power cycling environments. Offers insight into how to relate accelerated thermal cycling testing conditions to real world applications
- Offers new insight into solder joint reliability testing under multiple environments, including vibration environments
- Develops a methodology for predicting solder joint reliability using numerical simulations and experimental data under multiple environments that can be related to any package type
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Table of contents (11 chapters)
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Front Matter
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Back Matter
Keywords
About this book
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Authors and Affiliations
Bibliographic Information
Book Title: Solder Joint Reliability Prediction for Multiple Environments
Authors: Andrew E. Perkins, Suresh K. Sitaraman
DOI: https://doi.org/10.1007/978-0-387-79394-8
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2009
Hardcover ISBN: 978-0-387-79393-1Published: 23 October 2008
Softcover ISBN: 978-1-4419-4634-8Published: 05 November 2010
eBook ISBN: 978-0-387-79394-8Published: 16 December 2008
Edition Number: 1
Number of Pages: XVI, 192
Number of Illustrations: 70 b/w illustrations
Topics: Electronics and Microelectronics, Instrumentation, Metallic Materials, Optical and Electronic Materials, Quality Control, Reliability, Safety and Risk