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Transactions on Engineering Technologies

World Congress on Engineering 2019

Editors: Ao, Sio-Iong, Gelman, Len, Kim, Haeng Kon (Eds.)

  • Presents key, state-of-the-art advances in engineering technologies and physical science and applications
  • Serves as an excellent reference work for researchers and graduate students working with/on engineering technologies and physical science and applications
  • Contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019)
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eBook $169.00
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  • The eBook version of this title will be available soon
  • Due: 18 de Dezembro de 2020
  • ISBN 978-981-15-8273-8
  • Digitally watermarked, DRM-free
  • Included format:
  • ebooks can be used on all reading devices
Hardcover $219.99
price for Brazil
  • Customers within the U.S. and Canada please contact Customer Service at +1-800-777-4643, Latin America please contact us at +1-212-460-1500 (24 hours a day, 7 days a week). Pre-ordered printed titles are excluded from promotions.
  • Due: 20 de Novembro de 2020
  • ISBN 978-981-15-8272-1
  • Free shipping for individuals worldwide. Please be advised Covid-19 shipping restrictions apply. Please review prior to ordering.
  • Immediate ebook access, if available*, with your print order
About this book

This book contains a selection of research articles written by prominent researchers participating in The 27th World Congress on Engineering (WCE 2019) which was held in London, UK, July 3–5, 2019. 

Topics covered include engineering mathematics, electrical engineering, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. With contributions carefully chosen to represent the most cutting-edge research presented during the conference, the book contains some of the state of the art in engineering technologies and the physical sciences and their applications and serves as a useful reference for researchers and graduate students working in these fields.

About the authors

Dr. Sio-Iong Ao finished his doctoral research at The University of Hong Kong and postdoctoral researches at the University of Oxford and Harvard University and is a former Visiting Professor of Cranfield University, UK, and University of Wyoming, USA.

Len Gelman, PhD, Dr. of Sciences (Habilitation) joined HuddersfieldUniversity as Professor, Chair in Signal Processing/ Condition Monitoring and Director of Centre for Efficiency and Performance Engineering, in 2017 from Cranfield University, where he worked as Professor and Chair in Vibro-Acoustical Monitoring since 2002.

Len developed novel condition monitoring technologies for aircraft engines, gearboxes, bearings, turbines and centrifugal compressors. Len published more than 250 publications, 17 patents and is co-editor of 11 Springer books. He is Fellow of:BINDT, International Association of Engineers and Institution of Diagnostic Engineers, Executive Director, International Society for Condition Monitoring, Honorary Technical Editor, International Journal of Condition Monitoring, Editor-in-Chief, International Journal of Engineering Sciences (SCMR),Chair, annual International Condition Monitoring Conferences, Honorary Co-Chair, annual World Congresses of Engineering, Co-Chair, International Conference COMADEM 2019 and  Chair, International Scientific Committee of Third World Congress, Condition Monitoring.

He was General Chair,First World Congress, Condition Monitoring, Chair, Second World Congress, Engineering Asset Management and Chair, International Committee of Second World Congress, Condition Monitoring.Len is Chair of International CM Groups of ICNDT and EFNDT and Member of ISO Technical Committee, Condition Monitoring. Len made 42 plenary keynotes at major international conferences. He was Visiting Professor at ten Universities abroad.

Professor Haeng-Kon Kim is a Vice President of Research and Information, a Dean of engineering college and a Professor in the Department of Computer Engineering Catholic University of Daegu, in Korea. He has been a research staff member in Bell Lab. and NASA Center in USA. Professor Kim is Chief Editor of KIPS SE-Sig journal and Korea Multimedia Society, an editorial board of KISS (Korea Information Science Society) and a steering committee of KIPS (Korea Information Processing Society).

Buy this book

eBook $169.00
price for Brazil
  • The eBook version of this title will be available soon
  • Due: 18 de Dezembro de 2020
  • ISBN 978-981-15-8273-8
  • Digitally watermarked, DRM-free
  • Included format:
  • ebooks can be used on all reading devices
Hardcover $219.99
price for Brazil
  • Customers within the U.S. and Canada please contact Customer Service at +1-800-777-4643, Latin America please contact us at +1-212-460-1500 (24 hours a day, 7 days a week). Pre-ordered printed titles are excluded from promotions.
  • Due: 20 de Novembro de 2020
  • ISBN 978-981-15-8272-1
  • Free shipping for individuals worldwide. Please be advised Covid-19 shipping restrictions apply. Please review prior to ordering.
  • Immediate ebook access, if available*, with your print order
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Bibliographic Information

Bibliographic Information
Book Title
Transactions on Engineering Technologies
Book Subtitle
World Congress on Engineering 2019
Editors
  • Sio-Iong Ao
  • Len Gelman
  • Haeng Kon Kim
Copyright
2021
Publisher
Springer Singapore
Copyright Holder
The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd.
eBook ISBN
978-981-15-8273-8
DOI
10.1007/978-981-15-8273-8
Hardcover ISBN
978-981-15-8272-1
Edition Number
1
Number of Pages
VII, 256
Number of Illustrations
68 b/w illustrations, 63 illustrations in colour
Topics

*immediately available upon purchase as print book shipments may be delayed due to the COVID-19 crisis. ebook access is temporary and does not include ownership of the ebook. Only valid for books with an ebook version. Springer Reference Works and instructor copies are not included.