Overview
- Presents papers from the 3rd International Congress of Electrical and Computer Engineering (ICECENG 2024)
- Brings together researchers, developers, students in computing, technology trends, artificial intelligence, and security
- Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE
Part of the book series: EAI/Springer Innovations in Communication and Computing (EAISICC)
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About this book
This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG’24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching.
Keywords
- Computer Science
- Informatics
- Conference Proceedings
- Research
- Applications
Editors and Affiliations
About the editor
Muhammet Nuri Seyman works as aprofessor at Electrical and Electronics Engineering Department at the Bandirma Onyedi Eylul University of Turkey. His current research interests include multicarrier techniques such as OFDM, MC-CDMA, NOMA and MIMO systems and applications of artificial intelligence approaches for communications problems.
Bibliographic Information
Book Title: 3rd International Congress of Electrical and Computer Engineering
Book Subtitle: ICECENG 2024
Editors: Muhammet Nuri Seyman
Series Title: EAI/Springer Innovations in Communication and Computing
Publisher: Springer Cham
eBook Packages: Engineering, Engineering (R0)
Copyright Information: European Alliance for Innovation 2025
Hardcover ISBN: 978-3-031-88998-1Due: 23 August 2025
Softcover ISBN: 978-3-031-89001-7Due: 23 August 2026
eBook ISBN: 978-3-031-88999-8Due: 23 August 2025
Series ISSN: 2522-8595
Series E-ISSN: 2522-8609
Edition Number: 1
Number of Pages: V, 474
Number of Illustrations: 26 b/w illustrations, 160 illustrations in colour