Overview
- Serves as a collection of the best-known-methods and ideas from leaders in the field.
- Includes a carefully-selected set of discussions on the important issues, tradeoffs, and techniques in coupled data I/O.
- Provides an overview of the circuits, architectures, and chip packaging for coupled data techniques.
- Covers the new and emerging area of coupled data communication.
- Includes supplementary material: sn.pub/extras
Part of the book series: Integrated Circuits and Systems (ICIR)
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Keywords
Table of contents (8 chapters)
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Introduction
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Overview of 3D Technologies
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Coupled Data Technologies
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Enabling Coupled Data Technologies
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Extending Data Coupling Technologies
Editors and Affiliations
Bibliographic Information
Book Title: Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Editors: Ron Ho, Robert Drost
Series Title: Integrated Circuits and Systems
DOI: https://doi.org/10.1007/978-1-4419-6588-2
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2010
Hardcover ISBN: 978-1-4419-6587-5Published: 23 June 2010
Softcover ISBN: 978-1-4614-2617-2Published: 05 September 2012
eBook ISBN: 978-1-4419-6588-2Published: 03 June 2010
Series ISSN: 1558-9412
Series E-ISSN: 1558-9420
Edition Number: 1
Number of Pages: XVI, 206
Number of Illustrations: 183 b/w illustrations
Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Electrical Engineering, Computer Hardware