Authors:
- Introduces the use of HTS materials in wireless communication
- Presents several types of HTS BPF models to verify the design methods
- Discusses both theoretical and experimental analysis
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Table of contents (9 chapters)
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Front Matter
About this book
Authors and Affiliations
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Xi’an Jiaotong University, Xi’an, China
Haiwen Liu
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East China Jiaotong University, Nanchang, China
Baoping Ren, Xuehui Guan, Pin Wen
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China Electronics Technology Group Corporation, Hefei, China
Tao Zuo
About the authors
His current research interests include electromagnetic modeling of high-temperature superconducting circuits, RF and microwave passive circuits and systems, synthesis theory and practices of microwave filters and devices, antennas for wireless terminals, and radar system. He has published more than 100 papers in international and domestic journals and conferences. He has served as a Technical Program Committee (TPC) member for many international conferences and the reviewer for some international journals including IEEE Transactions on Microwave Theory and Technique, IEEE Transactions on Applied Superconductivity, IEEE Transactions on Industrial Electronics, IEEE Transactions on Components, Packaging and Manufacturing Technology, IEEE Microwave and Wireless Components Letters, IEEE Antennas and Wireless Propagation Letters. He is the recipient of Wang Kuancheng Science Foundation (2008), the Best Paper Prize of 2005International Conference on Communications, Circuits and Systems Proceedings(Hong Kong), the Prize of Osaka City Mayor of Conference of Chinese Alumni in Japan (2005), the 100 Best Ph.D Dissertations in Shanghai, China (2006), National distinguished Ph.D student Scholarship, China (2003), National First-class GuangHua Education Scholarship, China (2002), and Huawei Co. Scholarship, China (1999).
Bibliographic Information
Book Title: High-Temperature Superconducting Microwave Circuits and Applications
Authors: Haiwen Liu, Baoping Ren, Xuehui Guan, Pin Wen, Tao Zuo
DOI: https://doi.org/10.1007/978-981-13-6868-4
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Science Press, Beijing and Springer Nature Singapore Pte Ltd. 2019
Hardcover ISBN: 978-981-13-6867-7Published: 11 April 2019
eBook ISBN: 978-981-13-6868-4Published: 02 April 2019
Edition Number: 1
Number of Pages: XII, 272
Number of Illustrations: 29 b/w illustrations, 276 illustrations in colour
Additional Information: Jointly published with Science Press, Beijing
Topics: Microwaves, RF and Optical Engineering, Information and Communication, Circuits, Strongly Correlated Systems, Superconductivity, Optical and Electronic Materials, Astronomy, Observations and Techniques