Skip to main content
Book cover

Polycrystalline Semiconductors

Grain Boundaries and Interfaces

  • Conference proceedings
  • © 1989

Overview

Part of the book series: Springer Proceedings in Physics (SPPHY, volume 35)

This is a preview of subscription content, log in via an institution to check access.

Access this book

eBook USD 129.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (53 papers)

  1. Segregation, Activation and Passivation I

Keywords

Editors and Affiliations

  • Department of Materials Science and Engineering, Case Western Reserve University, Cleveland, USA

    Hans J. Möller

  • Technische Universität Hamburg-Harburg, Hamburg 90, Fed. Rep. of Germany

    Horst P. Strunk

  • Max-Planck-Institut für Festkörperforschung, Stuttgart 80, Fed. Rep. of Germany

    Jürgen H. Werner

Bibliographic Information

  • Book Title: Polycrystalline Semiconductors

  • Book Subtitle: Grain Boundaries and Interfaces

  • Editors: Hans J. Möller, Horst P. Strunk, Jürgen H. Werner

  • Series Title: Springer Proceedings in Physics

  • DOI: https://doi.org/10.1007/978-3-642-93413-1

  • Publisher: Springer Berlin, Heidelberg

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer-Verlag Berlin Heidelberg 1989

  • Softcover ISBN: 978-3-642-93415-5Published: 18 April 2014

  • eBook ISBN: 978-3-642-93413-1Published: 06 December 2012

  • Series ISSN: 0930-8989

  • Series E-ISSN: 1867-4941

  • Edition Number: 1

  • Number of Pages: XI, 394

  • Number of Illustrations: 250 b/w illustrations, 3 illustrations in colour

  • Topics: Electronics and Microelectronics, Instrumentation, Physical Chemistry, Surfaces and Interfaces, Thin Films

Publish with us