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A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies

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  • © 2018

Overview

Part of the book series: SpringerBriefs in Computer Science (BRIEFSCOMPUTER)

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Table of contents (7 chapters)

Keywords

About this book

This book is a valuable resource to deeply understand the technology used in 3D cameras. In this book, the authors summarize and compare the specifications of the main 3D cameras available in the mass market. The authors present a deep metrological analysis of the main camera based on the three main technologies: Time-of-Flight, Structured-Light and Active Stereoscopy, and provide qualitative results for any user to understand the underlying technology within 3D camera, as well as practical guidance on how to get the most of them for a given application.

Authors and Affiliations

  • Visual Computing Center, King Abdullah University of Science, Thuwal, Saudi Arabia

    Silvio Giancola

  • Mechanical Engineering Department, Polytechnic University of Milan, Milan, Italy

    Matteo Valenti

  • Polytechnic University of Milan , Milan, Italy

    Remo Sala

Bibliographic Information

  • Book Title: A Survey on 3D Cameras: Metrological Comparison of Time-of-Flight, Structured-Light and Active Stereoscopy Technologies

  • Authors: Silvio Giancola, Matteo Valenti, Remo Sala

  • Series Title: SpringerBriefs in Computer Science

  • DOI: https://doi.org/10.1007/978-3-319-91761-0

  • Publisher: Springer Cham

  • eBook Packages: Computer Science, Computer Science (R0)

  • Copyright Information: The Author(s), under exclusive licence to Springer International Publishing AG, part of Springer Nature 2018

  • Softcover ISBN: 978-3-319-91760-3Published: 27 June 2018

  • eBook ISBN: 978-3-319-91761-0Published: 19 June 2018

  • Series ISSN: 2191-5768

  • Series E-ISSN: 2191-5776

  • Edition Number: 1

  • Number of Pages: IX, 90

  • Number of Illustrations: 13 b/w illustrations, 88 illustrations in colour

  • Topics: Computer Imaging, Vision, Pattern Recognition and Graphics, Robotics and Automation, Artificial Intelligence

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