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  • © 2015

Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

  • A collection of 3D FPGA architecture exploration, physical design, implementation methodologies and CAD tools for Tree-based FPGA architecture
  • Presents new and practical 3D FPGA interconnect topologies and architecture to improve the performance, area and logic density of modern FPGA designs
  • Provides a foundation for building 3D reconfigurable devices which meets the requirements of today's prototyping and manufacturing industry
  • Includes supplementary material: sn.pub/extras

Part of the book series: Lecture Notes in Electrical Engineering (LNEE, volume 350)

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Table of contents (9 chapters)

  1. Front Matter

    Pages i-xxi
  2. An Overview of Three-Dimensional Integration and FPGAs

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 1-12
  3. Three-Dimensional Integration: A More Than Moore Technology

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 13-41
  4. Field Programmable Gate Arrays: An Overview

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 43-71
  5. Two Dimensional FPGAs: Configuration and CAD Flow

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 73-94
  6. Three-Dimensional FPGAs: Configuration and CAD Development

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 95-116
  7. Three-Dimensional Tree-Based FPGA: Architecture Exploration Tools and Technologies

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 117-146
  8. Three-Dimensional Thermal Modeling: Tools and Methodologies

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 147-168
  9. Physical Design and Implementation of 3D Tree-Based FPGAs

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 169-199
  10. Three-Dimensional FPGAs: Future Lines of Research

    • Vinod Pangracious, Zied Marrakchi, Habib Mehrez
    Pages 201-209
  11. Back Matter

    Pages 211-226

About this book

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Authors and Affiliations

  • Electrical and Computer Engineering Department, School of Engineering, American University in Dubai,, Dubai, Utd.Arab.Emir.

    Vinod Pangracious

  • Flexras Technologies, Biocitech, Romainville, France

    Zied Marrakchi

  • University of Pierre and Marie Curie, Paris VI, Paris, France

    Habib Mehrez

Bibliographic Information

  • Book Title: Three-Dimensional Design Methodologies for Tree-based FPGA Architecture

  • Authors: Vinod Pangracious, Zied Marrakchi, Habib Mehrez

  • Series Title: Lecture Notes in Electrical Engineering

  • DOI: https://doi.org/10.1007/978-3-319-19174-4

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2015

  • Hardcover ISBN: 978-3-319-19173-7Published: 08 July 2015

  • Softcover ISBN: 978-3-319-38687-4Published: 19 October 2016

  • eBook ISBN: 978-3-319-19174-4Published: 25 June 2015

  • Series ISSN: 1876-1100

  • Series E-ISSN: 1876-1119

  • Edition Number: 1

  • Number of Pages: XXI, 226

  • Number of Illustrations: 11 b/w illustrations, 102 illustrations in colour

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures

Buy it now

Buying options

eBook USD 84.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book USD 109.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access