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Arbitrary Modeling of TSVs for 3D Integrated Circuits

  • Book
  • © 2015

Overview

Authors:
  1. Khaled Salah

    1. Mentor Graphics, Heliopolis, Egypt

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  2. Yehea Ismail

    1. The American University (New Cairo) and Zewail City of Science and Technology (6th of October City), New Cairo, Egypt

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    You can also search for this author in PubMed   Google Scholar

  3. Alaa El-Rouby

    1. Mentor Graphics, Heliopolis, Egypt

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  • Introduces a robust model that captures accurately all the loss modes of a TSV, coupling parasitics between TSVs and the TSV nonlinear capacitance and resistance of the depletion region
  • Enables readers to use a model which is technology dependent and can be used for any TSV configuration
  • Reveals a novel on-chip wireless communication technique, based on TSV spiral inductors
  • Equips readers for fast parasitic extraction of TSVs for 3D IC design
  • Includes supplementary material: sn.pub/extras

Part of the book series: Analog Circuits and Signal Processing (ACSP)

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Table of contents (10 chapters)

  1. Front Matter

    Pages i-ix
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  2. Introduction: Work Around Moore’s Law

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 1-15

  3. 3D/TSV-Enabling Technologies

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 17-47

  4. TSV Modeling and Analysis

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 49-83

  5. TSV Verification

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 85-94

  6. TSV Macro-Modeling Framework

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 95-101

  7. TSV Design Applications: TSV-Based On-Chip Spiral Inductor, TSV-Based On-Chip Wireless Communications, and TSV-Based Bandpass Filter

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 103-131

  8. Imperfection in TSV Modeling

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 133-147

  9. New Trends in TSV

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 149-162

  10. TSV Fabrication

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 163-172

  11. Conclusions

    • Khaled Salah, Yehea Ismail, Alaa El-Rouby
    Pages 173-175

  12. Back Matter

    Pages 177-179
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Keywords

About this book

This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Authors and Affiliations

  • Mentor Graphics, Heliopolis, Egypt

    Khaled Salah, Alaa El-Rouby

  • The American University (New Cairo) and Zewail City of Science and Technology (6th of October City), New Cairo, Egypt

    Yehea Ismail

Bibliographic Information

  • Book Title: Arbitrary Modeling of TSVs for 3D Integrated Circuits

  • Authors: Khaled Salah, Yehea Ismail, Alaa El-Rouby

  • Series Title: Analog Circuits and Signal Processing

  • DOI: https://doi.org/10.1007/978-3-319-07611-9

  • Publisher: Springer Cham

  • eBook Packages: Engineering, Engineering (R0)

  • Copyright Information: Springer International Publishing Switzerland 2015

  • Hardcover ISBN: 978-3-319-07610-2Published: 05 September 2014

  • Softcover ISBN: 978-3-319-37497-0Published: 23 August 2016

  • eBook ISBN: 978-3-319-07611-9Published: 21 August 2014

  • Series ISSN: 1872-082X

  • Series E-ISSN: 2197-1854

  • Edition Number: 1

  • Number of Pages: IX, 179

  • Number of Illustrations: 60 b/w illustrations, 99 illustrations in colour

  • Topics: Circuits and Systems, Electronics and Microelectronics, Instrumentation, Processor Architectures

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