Editors:
Buy it now
Buying options
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, log in via an institution to check for access.
Table of contents (23 chapters)
-
Front Matter
About this book
Editors and Affiliations
-
Hewlett-Packard Company, Palo Alto, USA
John H. Lau
Bibliographic Information
Book Title: Thermal Stress and Strain in Microelectronics Packaging
Editors: John H. Lau
DOI: https://doi.org/10.1007/978-1-4684-7767-2
Publisher: Springer New York, NY
-
eBook Packages: Springer Book Archive
Copyright Information: Van Nostrand Reinhold 1993
Softcover ISBN: 978-1-4684-7769-6Published: 30 April 2012
eBook ISBN: 978-1-4684-7767-2Published: 06 December 2012
Edition Number: 1
Number of Pages: XXIV, 884
Number of Illustrations: 466 b/w illustrations
Topics: Electronics and Microelectronics, Instrumentation, Science, Humanities and Social Sciences, multidisciplinary