Overview
Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 267)
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Table of contents (7 chapters)
Keywords
About this book
Points of interest include :
- Clear overview of MCM technology and its relationship to physical design;
- Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects;
- Different approaches to multilayer MCM routing collected together and compared for the first time;
- Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach;
- Quantitative data provided wherever possible for comparison of different approaches;
- A comprehensive list of references to recent literature on MCMs provided.
Authors and Affiliations
Bibliographic Information
Book Title: Physical Design for Multichip Modules
Authors: M. Sriram, S. M. Kang
Series Title: The Springer International Series in Engineering and Computer Science
DOI: https://doi.org/10.1007/978-1-4615-2682-7
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1994
Hardcover ISBN: 978-0-7923-9450-1Published: 31 March 1994
Softcover ISBN: 978-1-4613-6153-4Published: 08 October 2012
eBook ISBN: 978-1-4615-2682-7Published: 06 December 2012
Series ISSN: 0893-3405
Edition Number: 1
Number of Pages: XV, 197
Topics: Circuits and Systems, Electrical Engineering, Computer-Aided Engineering (CAD, CAE) and Design