Authors:
Buy it now
Buying options
Tax calculation will be finalised at checkout
Other ways to access
This is a preview of subscription content, log in via an institution to check for access.
Table of contents (14 chapters)
-
Front Matter
-
Back Matter
About this book
On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively.
On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance.
On-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.
Authors and Affiliations
-
Northwestern University, USA
Yehea I. Ismail
-
University of Rochester, USA
Eby G. Friedman
Bibliographic Information
Book Title: On-Chip Inductance in High Speed Integrated Circuits
Authors: Yehea I. Ismail, Eby G. Friedman
DOI: https://doi.org/10.1007/978-1-4615-1685-9
Publisher: Springer New York, NY
-
eBook Packages: Springer Book Archive
Copyright Information: Kluwer Academic Publishers 2001
Hardcover ISBN: 978-0-7923-7293-6Published: 28 February 2001
Softcover ISBN: 978-1-4613-5677-6Published: 23 October 2012
eBook ISBN: 978-1-4615-1685-9Published: 06 December 2012
Edition Number: 1
Number of Pages: XXII, 303
Topics: Circuits and Systems, Electrical Engineering, Computer-Aided Engineering (CAD, CAE) and Design