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Table of contents (8 chapters)
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Front Matter
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Back Matter
Keywords
About this book
As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.
The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
Authors and Affiliations
Bibliographic Information
Book Title: Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses
Book Subtitle: Fundamental Mechanisms and Application to IC Interconnect Technology
Authors: Christopher L. Borst, William N. Gill, Ronald J. Gutmann
DOI: https://doi.org/10.1007/978-1-4615-1165-6
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2002
Hardcover ISBN: 978-1-4020-7193-5Published: 30 September 2002
Softcover ISBN: 978-1-4613-5424-6Published: 23 February 2014
eBook ISBN: 978-1-4615-1165-6Published: 27 November 2013
Edition Number: 1
Number of Pages: XIV, 229
Topics: Manufacturing, Machines, Tools, Processes, Electrical Engineering, Theoretical and Computational Chemistry, Optical and Electronic Materials