Overview
- Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas;
- Compares strengths and weaknesses of three leading, generic fabrication processes for ultra-thin chips;
- Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips
- Includes supplementary material: sn.pub/extras
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About this book
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
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Keywords
Table of contents (34 chapters)
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Front Matter
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From Thick Wafers to Ultra-Thin Silicon Chips
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Front Matter
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Thin Chip Fabrication Technologies
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Front Matter
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Assembly and Embedding of Ultra-Thin Chips
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Front Matter
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Editors and Affiliations
Bibliographic Information
Book Title: Ultra-thin Chip Technology and Applications
Editors: Joachim Burghartz
DOI: https://doi.org/10.1007/978-1-4419-7276-7
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Science+Business Media, LLC 2011
Hardcover ISBN: 978-1-4419-7275-0Published: 19 November 2010
Softcover ISBN: 978-1-4939-5118-5Published: 23 August 2016
eBook ISBN: 978-1-4419-7276-7Published: 18 November 2010
Edition Number: 1
Number of Pages: XXII, 467
Topics: Circuits and Systems, Computer-Aided Engineering (CAD, CAE) and Design