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  • © 2010

Constrained Deformation of Materials

Devices, Heterogeneous Structures and Thermo-Mechanical Modeling

Authors:

  • Presents constrained deformation capabilities in thin films and small-volume materials

  • Links the microelectronics and composite materials fields through common principles and proper analytical approaches

  • Provides a modeling and mechanical analyses of advanced micro- and nanostructures appealing to numerical modeling and experimentalist communities alike

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Table of contents (7 chapters)

  1. Front Matter

    Pages i-ix
  2. Introduction

    • Y.-L. Shen
    Pages 1-11
  3. Mechanics Preliminaries

    • Y.-L. Shen
    Pages 13-34
  4. Thin Continuous Films

    • Y.-L. Shen
    Pages 35-76
  5. Patterned Films in Micro-devices

    • Y.-L. Shen
    Pages 77-123
  6. Electronic Packaging Structures

    • Y.-L. Shen
    Pages 125-168
  7. Heterogeneous Materials

    • Y.-L. Shen
    Pages 169-262
  8. Challenges and Outlook

    • Y.-L. Shen
    Pages 263-274
  9. Back Matter

    Pages 275-281

About this book

"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.

Authors and Affiliations

  • Dept. Mechanical Engineering, University of New Mexico, Albuquerque, USA

    Y.-L. Shen

About the author

Yu-Lin Shen is currently Professor and Interim Chair in the Department of Mechanical Engineering at University of New Mexico. He received his Ph.D. in engineering from Brown University in 1994, and was a post-doctoral research associate at Massachusetts Institute of Technology before joining the faculty of University of New Mexico in 1996. Professor Shen is widely recognized for his research in mechanical behavior of materials, especially in modeling. His numerical modeling experience spans disparate length scales from the continuum level down to atomistics, focusing on mechanical issues related to thin films, composite materials and microelectronic devices and packages. He has published over 140 research papers in these areas, mostly in international journals. In 2005 Professor Shen was elected Fellow of the American Society of Mechanical Engineers (ASME).

Bibliographic Information

Buy it now

Buying options

eBook USD 129.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 169.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 169.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access