Overview
- Covers the latest research that has been carried on in the area of thermal and power management of integrated circuits with emphasis on performance and reliability of ICs at system and circuit level
- No book provides cohesive treatment of the material
- Will give researchers a perspective on the subject and will help them to carry their research and development with deep knowledge of thermal issues
- Includes supplementary material: sn.pub/extras
Part of the book series: Integrated Circuits and Systems (ICIR)
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Table of contents (6 chapters)
Keywords
About this book
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.
This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Authors and Affiliations
Bibliographic Information
Book Title: Thermal and Power Management of Integrated Circuits
Authors: Arman Vassighi, Manoj Sachdev
Series Title: Integrated Circuits and Systems
DOI: https://doi.org/10.1007/0-387-29749-9
Publisher: Springer New York, NY
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer-Verlag US 2006
Hardcover ISBN: 978-0-387-25762-4Published: 04 January 2006
Softcover ISBN: 978-1-4419-3832-9Published: 29 November 2010
eBook ISBN: 978-0-387-29749-1Published: 01 June 2006
Series ISSN: 1558-9412
Series E-ISSN: 1558-9420
Edition Number: 1
Number of Pages: X, 182
Topics: Circuits and Systems, Engineering Design, Computer-Aided Engineering (CAD, CAE) and Design, Electrical Engineering