Overview
Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 719)
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Table of contents (4 chapters)
Keywords
About this book
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Reviews
From the reviews:
"Fatigue Life Prediction of Solder Joints in Electronic Packages … excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. … there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)
Authors and Affiliations
Bibliographic Information
Book Title: Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Authors: Erdogan Madenci, Ibrahim Guven, Bahattin Kilic
Series Title: The Springer International Series in Engineering and Computer Science
DOI: https://doi.org/10.1007/978-1-4615-0255-5
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 2003
Hardcover ISBN: 978-1-4020-7330-4Published: 31 December 2002
Softcover ISBN: 978-1-4613-4989-1Published: 14 October 2012
eBook ISBN: 978-1-4615-0255-5Published: 06 December 2012
Series ISSN: 0893-3405
Edition Number: 1
Number of Pages: XX, 185
Topics: Manufacturing, Machines, Tools, Processes, Optical and Electronic Materials, Electrical Engineering