Overview
- Presents simple and flexible modelling-methods
- Discuss model design of microstrip interconnection from multi-angles
- Addresses the theoretical analysis, calculation method, mathematical analysis and application analysis for each model
Access this book
Tax calculation will be finalised at checkout
Other ways to access
Table of contents (12 chapters)
Keywords
About this book
Editors and Affiliations
About the editor
- development and applications of negative group delay (NGD) circuits,
- the electrical RF/mixed circuit interconnect modelling for signal and power integrity (SI/PI) analysis,
- EM near-field scanning and modelling, electromagnetic compatibility/interference (EMC/EMI), and Multiphysics system engineering/modelling.
He is a pioneer of the development of NGD concept. Dr. Ravelo received the Dipl.-Ing. Degree in electronic engineering from the University of Antsiranana, Madagascar, in 2000. He received the Professional/Research Sci. Master degrees, and the Ph.D. degrees from Brest University, Brest, France, in 2004, 2005, and 2008, respectively. He hold his degree of dissertation to lead researches (“HDR: Habilitation à Diriger des Recherches”) from the Univ. of Rouen in 2012.
Dr. Ravelo is regularly involved and initiated to participate and to lead national and international research projects (FP7, INTERREG, ANR, FUI, H2020, Euripides, Eurostars) on the electronic, microwave and EMC engineering. He is (co)author of more than 210 papers published in international journals, book chapters, and conference proceedings. He co-supervised and directed 9 PhD students whose 6 PhD candidates defended.
Bibliographic Information
Book Title: Analytical Methodology of Tree Microstrip Interconnects Modelling For Signal Distribution
Book Subtitle: Voltage Transfer Function and S-parameter Analyses
Editors: Blaise Ravelo
DOI: https://doi.org/10.1007/978-981-15-0552-2
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Nature Singapore Pte Ltd. 2020
Hardcover ISBN: 978-981-15-0551-5Published: 07 February 2020
Softcover ISBN: 978-981-15-0554-6Published: 26 August 2021
eBook ISBN: 978-981-15-0552-2Published: 21 November 2019
Edition Number: 1
Number of Pages: XIII, 233
Number of Illustrations: 67 b/w illustrations, 78 illustrations in colour
Topics: Microwaves, RF and Optical Engineering, Circuits and Systems, Communications Engineering, Networks