Overview
The first-ever book on electromagnetic ultrasonic guided wave imaging
Offers novel simulation and experimental methods for defect imaging
Presents useful methodologies for using the new technology for defect imaging and nondestructive testing
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Table of contents (5 chapters)
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Front Matter
Keywords
About this book
Authors and Affiliations
About the authors
Yu Zhang received the bachelor’s degree from North China Electric Power University in 2013, and the Ph.D. degree with the Department of Electrical Engineering from Tsinghua University in 2017. His research interests include nondestructive testing and evaluation.
Zheng Wei received the bachelor’s degree from Tsinghua University in 2009, and the Ph.D. degree with the Department of Electrical Engineering from Tsinghua University in 2015. His research interests include nondestructive testing and evaluation.
Shen Wang received the bachelor’s and Ph.D. degrees in electrical engineering from Tsinghua University, Beijing, China, in 2002 and 2008, respectively. He is currently an Associate Professor within the Department of Electrical Engineering, Tsinghua University. His research interests include nondestructive testing and evaluation, and virtual instrumentation.
Hongyu Sun received the bachelor’s degree from the Department of Renewable Energy, North China Electric Power University, Beijing, China, in 2015, and the master’s degree from the department of Electrical and Electronic Engineering, North China Electric Power University, Beijing, China, in 2018. He is currently pursuing the Ph.D. degree within the Department of Electrical Engineering, Tsinghua University. His major research interests include electromagnetic measurement, nondestructive evaluation, and plasma physics.
Bibliographic Information
Book Title: Theory and Methodology of Electromagnetic Ultrasonic Guided Wave Imaging
Authors: Songling Huang, Yu Zhang, Zheng Wei, Shen Wang, Hongyu Sun
DOI: https://doi.org/10.1007/978-981-13-8602-2
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Tsinghua University Press 2020
Hardcover ISBN: 978-981-13-8601-5Published: 10 July 2019
Softcover ISBN: 978-981-13-8604-6Published: 14 August 2020
eBook ISBN: 978-981-13-8602-2Published: 29 June 2019
Edition Number: 1
Number of Pages: IX, 289
Number of Illustrations: 167 b/w illustrations, 20 illustrations in colour
Additional Information: Jointly published with Tsinghua University Press, Beijing, China.
Topics: Microwaves, RF and Optical Engineering, Signal, Image and Speech Processing, Measurement Science and Instrumentation