Overview
- Is the first book available on modeling and applications of transfer printing of flexible electronics
- Includes multiple processes developed according to the geometric shape of chips and devices
- Offers detailed modeling and computation steps for each process
- Discusses transfer printing equipment to help readers quickly learn how to use it
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Table of contents (9 chapters)
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Front Matter
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Back Matter
Keywords
About this book
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
Authors and Affiliations
About the authors
Zhouping Yin received the B.S. and Ph.D. degrees in mechanical engineering from Huazhong University of Science and Technology (HUST), Wuhan, China, in 1994 and 2000, respectively. He is a Distinguished Professor and has been the Vice Head of the State Key Laboratory of Digital Manufacturing Equipment and Technology, HUST, since 2005. He is a Principal Investigator for projects sponsored by the General Program and Major Program of the National Science Foundation and the National Basic Research Project of China. He is leading a research group and conducting research in the electronic manufacturing equipment and technology, including printed electronics and radio frequency identification packaging. Dr. Yin was appointed as the Changjiang Distinguished Professor from Ministry of Education of China in 2009. He received the National Science Fund for Distinguished Young Scholars of China.
Xiaodong Wan received his B.S. and Ph.D. degrees in engineering mechanics from Huazhong University of Science and Technology (HUST), Wuhan, China, in 2012 and 2016, respectively. He is currently a Postdoctoral Fellow at the School of Mechanical Science and Engineering, HUST. His research interests include flexible electronics manufacturing and laser processing. Dr. Wan received the Young Scientists Fund of the National Natural Science Foundation of China.
Bibliographic Information
Book Title: Modeling and Application of Flexible Electronics Packaging
Authors: YongAn Huang, Zhouping Yin, Xiaodong Wan
DOI: https://doi.org/10.1007/978-981-13-3627-0
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Science Press and Springer Nature Singapore Pte Ltd. 2019
Hardcover ISBN: 978-981-13-3626-3Published: 07 May 2019
eBook ISBN: 978-981-13-3627-0Published: 23 April 2019
Edition Number: 1
Number of Pages: XVII, 287
Additional Information: Jointly published with Science Press, Beijing, China
Topics: Electronics and Microelectronics, Instrumentation, Optical and Electronic Materials, Manufacturing, Machines, Tools, Processes, Theoretical and Applied Mechanics, Simulation and Modeling