Overview
- Nominated by Tsinghua University as an outstanding thesis in the field
- Includes a detailed experimental analysis of the surface characterization of Cu interconnects
- Presents advanced experimental methods for investigating Cu/Ru micro-galvanic corrosion
- Explains the experimental results in detail
Part of the book series: Springer Theses (Springer Theses)
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Table of contents (8 chapters)
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Front Matter
Keywords
About this book
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Authors and Affiliations
Bibliographic Information
Book Title: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Authors: Jie Cheng
Series Title: Springer Theses
DOI: https://doi.org/10.1007/978-981-10-6165-3
Publisher: Springer Singapore
eBook Packages: Engineering, Engineering (R0)
Copyright Information: Springer Nature Singapore Pte Ltd. 2018
Hardcover ISBN: 978-981-10-6164-6Published: 18 September 2017
Softcover ISBN: 978-981-13-5585-1Published: 30 January 2019
eBook ISBN: 978-981-10-6165-3Published: 06 September 2017
Series ISSN: 2190-5053
Series E-ISSN: 2190-5061
Edition Number: 1
Number of Pages: XVIII, 137
Number of Illustrations: 103 b/w illustrations
Topics: Manufacturing, Machines, Tools, Processes, Tribology, Corrosion and Coatings, Electronics and Microelectronics, Instrumentation