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  • Conference proceedings
  • © 2001

IUTAM Symposium on Creep in Structures

Part of the book series: Solid Mechanics and Its Applications (SMIA, volume 86)

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Table of contents (49 papers)

  1. Front Matter

    Pages i-xxii
  2. An Opening Address

    • D. R. Hayhurst
    Pages 1-2
  3. Creep of γ-TiAl Based Alloys — Experiments and Computational Modeling

    • W. T. Marketz, A. Chatterjee, F. D. Fischer, H. Clemens
    Pages 17-30
  4. Anisotropic Creep of Single Crystal Superalloys

    • D. M. Knowles, D. W. MacLachlan
    Pages 31-40
  5. A Rate Dependent Formulation for Void Growth in Single Crystal Materials

    • E. P. Busso, N. P. O’Dowd, R. J. Dennis
    Pages 41-50
  6. Microstructural Modeling of Creep Fracture in Polycrystalline Materials

    • P. R. Onck, B.-N. Nguyen, E. Van Der Giessen
    Pages 51-64
  7. Creep Crack Growth: From Discrete to Continuum Damage Modeling

    • B.-N. Nguyen, P. R. Onck, E. Van Der Giessen
    Pages 65-74
  8. Creep of Welded Structures

    • T. H. Hyde, W. Sun
    Pages 85-94
  9. Two Parameter Characterisation of Crack Tip Fields under Creep Conditions

    • A. D. Bettinson, N. P. O’Dowd, K. Nikbin, G. A. Webster
    Pages 95-104
  10. Multiaxial Creep Fatigue under Anisothermal Conditions

    • J. P. Sermage, J. Lemaitre, R. Desmorat
    Pages 125-130
  11. Constitutive Modeling of Viscoplastic Damage in Solder Material

    • Y. Wei, C. L. Chow, M. K. Neilsen, H. E. Fang
    Pages 131-140
  12. Cracking of Creeping Structures Described by Means of CDM

    • A. Bodnar, M. Chrzanowski
    Pages 189-196

About this book

The advent of steam turbines and the sudden rise of steam temperature at the beginning of the 20th century gave a great impetus to the start of scientific research on metal creep and high-temperature strength. Then aeronautical and aerospace exploitation in the 1940's and 1950's enlarged the scope of creep research. In this context, the first IUTAM Symposium on "Creep in Structures" was held at Stanford University in July 1960, and about 60 participants from seven countries around the world discussed their recent results on this problem. Subsequent innovation in science and technology, as in nuclear and new energy technology, new materials, large scale integration of semiconductors etc., has claimed solutions to new and challenging problems in this fundamental field of applied mechanics. In order to discuss the new topics in this discipline, the IUTAM Symposia "Creep in Structures" thereafter have been held every ten years; i.e. the second in 1970 at Gothenburg, Sweden, the third in 1980 at Leicester, U.K. and the fourth in 1990 at Cracow,Poland. The First (1960) and Second Symposium (1970) were concerned mainly with the phenomenological law of creep and creep analysis of structural elements, whereas the issues of the Third Symposium (1980) shifted toward the problems of creep damage, creep crack growth, practical and effective design methods, etc.

Editors and Affiliations

  • Nagoya University, Nagoya, Japan

    S. Murakami, N. Ohno

Bibliographic Information

  • Book Title: IUTAM Symposium on Creep in Structures

  • Editors: S. Murakami, N. Ohno

  • Series Title: Solid Mechanics and Its Applications

  • DOI: https://doi.org/10.1007/978-94-015-9628-2

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Springer Science+Business Media B.V. 2001

  • Hardcover ISBN: 978-0-7923-6737-6Published: 31 December 2000

  • Softcover ISBN: 978-90-481-5623-8Published: 04 December 2010

  • eBook ISBN: 978-94-015-9628-2Published: 27 November 2013

  • Series ISSN: 0925-0042

  • Series E-ISSN: 2214-7764

  • Edition Number: 1

  • Number of Pages: XXII, 522

  • Topics: Classical Mechanics

Buy it now

Buying options

eBook USD 259.00
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book USD 329.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book USD 329.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access