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Surface Mount Technology

Principles and Practice

  • Book
  • © 1989

Overview

Authors:
  1. Ray P. Prasad

    1. Systems Group, Intel Corporation, Hillsboro, USA

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Table of contents (14 chapters)

  1. Front Matter

    Pages i-xxiii
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  2. Introduction to Surface Mounting

    1. Front Matter

      Pages 1-1
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    2. Introduction to Surface Mount Technology

      • Ray P. Prasad
      Pages 3-39

    3. Implementing Surface Mount Technology

      • Ray P. Prasad
      Pages 41-61

  3. Designing with Surface Mounting

    1. Front Matter

      Pages 63-63
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    2. Surface Mount Components

      • Ray P. Prasad
      Pages 65-112

    3. Substrates for Surface Mounting

      • Ray P. Prasad
      Pages 113-162

    4. Surface Mount Design Considerations

      • Ray P. Prasad
      Pages 163-207

    5. Surface Mount Land Pattern Design

      • Ray P. Prasad
      Pages 209-233

    6. Design for Manufacturability, Testing, and Repair

      • Ray P. Prasad
      Pages 235-265

  4. Manufacturing with Surface Mounting

    1. Front Matter

      Pages 267-267
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    2. Adhesive and Its Application

      • Ray P. Prasad
      Pages 269-309

    3. Solder Paste and Its Application

      • Ray P. Prasad
      Pages 311-347

    4. Metallurgy of Soldering and Solderability

      • Ray P. Prasad
      Pages 349-386

    5. Component Placement

      • Ray P. Prasad
      Pages 387-421

    6. Soldering of Surface Mounted Components

      • Ray P. Prasad
      Pages 423-470

    7. Flux and Cleaning

      • Ray P. Prasad
      Pages 471-513

    8. Quality Control, Repair, and Testing

      • Ray P. Prasad
      Pages 515-563

  5. Back Matter

    Pages 565-610
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Keywords

About this book

Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech­ nology to produce state-of-the-art miniaturized electronic products. How­ ever, in order to take advantage of this technology, a complete infrastruc­ ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor­ mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im­ plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.

Authors and Affiliations

  • Systems Group, Intel Corporation, Hillsboro, USA

    Ray P. Prasad

Bibliographic Information

  • Book Title: Surface Mount Technology

  • Book Subtitle: Principles and Practice

  • Authors: Ray P. Prasad

  • DOI: https://doi.org/10.1007/978-94-011-6532-7

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Van Nostrand Reinhold 1989

  • Softcover ISBN: 978-94-011-6534-1Published: 07 March 2012

  • eBook ISBN: 978-94-011-6532-7Published: 06 December 2012

  • Edition Number: 1

  • Number of Pages: XXIV, 610

  • Topics: Science, Humanities and Social Sciences, multidisciplinary

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