Overview
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Table of contents (16 chapters)
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Overview
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Basic Technologies
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Methodologies and Applications
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Reliability, Quality Control and Tests
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Future Tasks and Emerging Trends
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Appendix
Keywords
About this book
Authors and Affiliations
Bibliographic Information
Book Title: Solder Paste in Electronics Packaging
Book Subtitle: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Authors: Jennie S. Hwang
DOI: https://doi.org/10.1007/978-94-011-6050-6
Publisher: Springer Dordrecht
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eBook Packages: Springer Book Archive
Copyright Information: Van Nostrand Reinhold 1989
Softcover ISBN: 978-94-011-6052-0Published: 20 February 2012
eBook ISBN: 978-94-011-6050-6Published: 06 December 2012
Edition Number: 1
Number of Pages: XXIV, 456
Topics: Science, Humanities and Social Sciences, multidisciplinary