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Cooling of Electronic Systems

  • Book
  • © 1994

Overview

Editors:
  1. S. Kakaç

    1. University of Miami, Coral Gables, USA

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  2. H. Yüncü

    1. Middle East Technical University, Ankara, Turkey

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  3. K. Hijikata

    1. Tokyo Institute of Technology, Tokyo, Japan

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Part of the book series: NATO Science Series E: (NSSE, volume 258)

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Table of contents (36 chapters)

  1. Front Matter

    Pages i-x
    Download chapter PDF

  2. Introduction to ASI on Cooling of Electronic Systems

    • Sadik kakaç
    Pages 1-15

  3. Trends in the Packaging of Computer Systems

    • Avram Bar-Cohen
    Pages 17-45

  4. Beyond Thermal Limits in Computer Systems Cooling

    • S. Oktay
    Pages 47-70

  5. Cooling Technology for High Performance Computers: Design Applications

    • R. C. Chu, R. E. Simons
    Pages 71-95

  6. Cooling Technology for High Performance Computers: IBM Sponsored University Research

    • R. C. Chu, R. E. Simons
    Pages 97-122

  7. Natural Convection Cooling of an Array of Heated Plates Simulating Printed Circuit Boards

    • T. O’Meara, D. Poulikakos
    Pages 123-144

  8. Convection in Arrays of Electronic Packages Containing Longitudinal Fin Heat Sinks

    • R. A. Wirtz, Weiming Chen, Dan Colban
    Pages 145-163

  9. Experiments on Natural Convective Air Cooling of a PCBs Array in a Closed Casing with Inclination

    • F. Mayinger, Z. G. Wang
    Pages 165-178

  10. Cooling of Multiple Heat Sources Attached to Two Dimensional Rectangular Fins

    • Mazhar Ünsal
    Pages 179-188

  11. Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays

    • M. Mobedi, H. Yüncü, B. Yücel
    Pages 189-202

  12. Cooling of a Microelectronic Sensor by Turbulent Forced Convection

    • D. Poulikakos, A. Wietrzak
    Pages 203-224

  13. Computation of Steady Laminar Natural Convective Heat Transfer from Localized Heat Sources in Enclosures

    • M. S. Söylemez, M. Ünsal
    Pages 225-238

  14. Unsteady Forced Convection in a Duct with and without Arrays of Block-Like Electronic Compoments

    • S. Kakaç, R. M. Cotta
    Pages 239-275

  15. Optimal Geometry of Convection Cooled Electronic Packages

    • Adrian Bejan, Sang W. Lee
    Pages 277-291

  16. A Thermal Design Approach for Electronic Equipment by Use of a Personal Computer and Flow Visualization

    • M. Ishizuka
    Pages 293-312

  17. Experimental Visualization of Temperature Fields and Measurement of Heat Transfer Enhancement in Electronic System Models

    • Cila Herman
    Pages 313-337

  18. Cooling of Electronic Systems by Impinging Air Jets

    • M. Can, E. Pulat
    Pages 339-359

  19. Numerical and Experimental Studies for the Conjugate Direct Cooling of a Micro Heat Generating Element

    • K. Hijikata, K. Fushinobu, T. Nagasaki, P. E. Phelan
    Pages 361-389

  20. The Cooling of Electronic Components with Flat Plate Heat Sinks

    • Robert J. Krane, Iqballudin Ahmed, J. Roger Parsons
    Pages 391-414
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Keywords

About this book

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book.
Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, togetherwith a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics.
Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Editors and Affiliations

  • University of Miami, Coral Gables, USA

    S. Kakaç

  • Middle East Technical University, Ankara, Turkey

    H. Yüncü

  • Tokyo Institute of Technology, Tokyo, Japan

    K. Hijikata

Bibliographic Information

  • Book Title: Cooling of Electronic Systems

  • Editors: S. Kakaç, H. Yüncü, K. Hijikata

  • Series Title: NATO Science Series E:

  • DOI: https://doi.org/10.1007/978-94-011-1090-7

  • Publisher: Springer Dordrecht

  • eBook Packages: Springer Book Archive

  • Copyright Information: Kluwer Academic Publishers 1994

  • Hardcover ISBN: 978-0-7923-2736-3Published: 28 February 1994

  • Softcover ISBN: 978-94-010-4476-9Published: 05 October 2013

  • eBook ISBN: 978-94-011-1090-7Published: 06 December 2012

  • Series ISSN: 0168-132X

  • Edition Number: 1

  • Number of Pages: X, 962

  • Topics: Circuits and Systems, Electrical Engineering, Engineering Design, Mechanical Engineering

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