Thermal Management of Electronic Systems

1. Front Matter

   Pages i-xi

   PDF

2. Invited Lectures

   1. Front Matter

      Pages 1-1

      PDF

   2. Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research

      • C. J. M. Lasance

      Pages 3-24

   3. Analysis and Prevention of Thermally Induced Failures in Electronic Equipment

      • Avram Bar-Cohen, Sorin Witzman

      Pages 25-42

3. Numerical and Experimental Analysis of Systems

   1. Front Matter

      Pages 43-43

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   2. Computational Analysis of Air and Heat Flow in Electronic Systems

      • S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield

      Pages 45-54

   3. Thermal Analysis of a Telecommunications Rack System

      • J. D. Parry, D. G. Tatchell

      Pages 55-64

   4. Supporting experiments for CFD based thermal design of telecommunication equipment

      • H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman et al.

      Pages 65-74

   5. Two complementary approaches for the thermal simulation of electronic equipment

      • J. L. Blanchard, J. M. Morelle

      Pages 75-84

   6. Some considerations on practical formulas used for thermal design of natural ventilated enclosures

      • M. Misale

      Pages 85-94

4. Numerical and Experimental Analysis of Channels

   1. Front Matter

      Pages 95-95

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   2. Natural Convection in a rectangular Enclosure with an Array of Chips Mounted on a Vertical Wall

      • C. Di Perna, A. Evangelisti, M. Paroncini, R. Ricci

      Pages 97-106

   3. Differences between 2D and 3D models predictions in a channel with a dissipating obstacle

      • J. B. Saulnier, H. Y. Wang, B. Fourka

      Pages 107-116

   4. Effect of radiation on natural convection in tilted channels

      • O. Manca, S. Nardini, V. Naso

      Pages 117-126

5. Numerical and Experimental Analysis of Electronic Parts

   1. Front Matter

      Pages 127-127

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   2. Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method

      • N. Ottavy, M. Bourhrara, J. -P. Le Jannou, P. Paris

      Pages 129-138

   3. Computer-Aided Optimization of Electrothermal CMOS-Compatible Infrared Sensors

      • G. Wachutka, J. Funk, H. Baltes

      Pages 139-148

   4. Mixed convection and heat transfer on vertical parallel printed circuit boards

      • S. Mergui, F. Penot

      Pages 149-158

   5. A parametric study of heat spreading through multiple layer substrates

      • J. Punch, M. Davies

      Pages 159-168

   6. Thermal drift effects in power microwave hybrid circuits

      • J. Alkhoja, D. Rauly, F. Grandjean

      Pages 169-178

The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera­ tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea­ sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.

• design
• development
• measurement techniques
• packaging
• stress

• J. M. Burgers Centre for Fluid Mechanics, Delft University of Technology, Delft, The Netherlands

  C. J. Hoogendoorn, R. A. W. M. Henkes

• Philips B.V., Eindhoven, The Netherlands

  C. J. M. Lasance

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